The utility model relates to a carbide formula moulding -die head structure belongs to the semiconductor packaging technology field. It includes moulding -die head body, moulding -die head body is made by the carbide material, moulding -die head body head includes central pattern (1) and peripheral moulding -die wall (4), (1) four side in the center pattern is provided with annular (2) all around, be provided with between annular (2) and the peripheral moulding -die wall (4) all around outside annular (3), the center pattern (1), all around the surface of annular (2), outside annular (3) and peripheral moulding -die wall (4) all be provided with one deck nanometer diamond cladding material. The utility model relates to a carbide formula moulding -die head structure, it can improve the life of moulding -die head by a wide margin to improve the homogeneity of distribution of moulding -die soldering tin and thickness.