The utility model discloses an embedded package structure based on semiconductor chip packaging body, embedded package structure includes: the circuit board, its first surface and second surface that has relative setting, locate but opening or cavity in the circuit board, at least one holding semiconductor chip packaging body, set up in semiconductor chip packaging body in opening or the cavity, the encapsulating material is to the first surface cover and the packing of major general's circuit board the space that is not occupied by the semiconductor chip packaging body in opening or the cavity, the layer of rerouting, but electrical connection semiconductor chip packaging body and circuit board at least. The utility model provides an embedded technical scheme of circuit board is adopted in the equipment of semiconductor chip packaging body, can simplify the packaging technology flow of semiconductor chip packaging body, improves equipment quality and performance, effectively reduces to assemble the area.