The utility model discloses a photoelectric device packaging structure based on metallic bonding. According to the embodiment, a photoelectric device packaging structure can be including light electric chip and encapsulation basement. Light electric chip include: the substrate has first surface relative each other and second surface, the photoelectric device who forms on the substrate, and the electrode that is used for photoelectric device that forms on the first surface. The encapsulation basement has first surface relative each other and second surface to include the electrically conductive passageway that extends to the second surface from the first surface. Smooth electric chip is in the same place with encapsulation basement superpose towards the mode that encapsulates the basement with its first surface, and electrode that forms on just smooth electric chip's the first surface and the corresponding electrically conductive passageway bonded that encapsulates in the basement are in the same place.