The utility model discloses a microwave vertical interconnect ceramic joining structure belongs to the high density packaging field, at internal heat dissipation liquid passageway, electric signal passageway and the signal shielding passageway of being provided with of ceramic base, at two upper and lower terminal surfaces of ceramic base member for parallel arrangement and all be provided with the pad, the periphery of every electric signal passageway is provided with a plurality of signals shielding passageway, and a plurality of signals shielding passageway all is parallel arrangement withthe electric signal passageway, electric signal passageway and signal shielding passageway all have a perfect understanding two upper and lower terminal surfaces of ceramic base member, offer the through -hole that corresponds on the pad that corresponds the department with heat dissipation liquid passageway, electric signal passageway and signal shielding channel position. Connector internal integration each other communication path of fluid, can provide the miniflow route of heat dissipation usefulness for multilayer stack structure. The utility model discloses add heat pipe reason content in electric signal vertical interconnect's design, fully ensured microwave signal vertical interconnect's characteristic.