发明公开
- 专利标题： Hybrid integrated circuit device
- 专利标题（中）： 混合集成电路。
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申请号： EP82303178.6申请日： 1982-06-18
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公开(公告)号： EP0068753A2公开(公告)日： 1983-01-05
- 发明人: Akasaki, Hidehiko
- 申请人： FUJITSU LIMITED
- 申请人地址： 1015, Kamikodanaka, Nakahara-ku Kawasaki-shi, Kanagawa 211 JP
- 专利权人： FUJITSU LIMITED
- 当前专利权人： FUJITSU LIMITED
- 当前专利权人地址： 1015, Kamikodanaka, Nakahara-ku Kawasaki-shi, Kanagawa 211 JP
- 代理机构： George, Sidney Arthur (GB)
- 优先权： JP94877/81U 19810625
- 主分类号： H01L25/16
- IPC分类号： H01L25/16 ; H01L23/04 ; H01L23/14 ; H01L23/56
摘要：
A hybrid integrated circuit device comprises, in combination, a semiconductor integrated circuit element (1) and a film resistor pattern (7). The film resistor pattern is formed on the outer surface of a base (6) which is mounted on a multilayer ceramic package (2) which incorporates the element. In this assembled hybrid device, function trimming of the film resistor pattern can be carried out by using a computer whilst the device is operating.
公开/授权文献
- EP0068753B1 Hybrid integrated circuit device 公开/授权日：1987-09-30
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