发明公开
EP0129966A1 High cooling efficiency circuit module
失效
Schaltkreismodul mitKühleinrichtungvon hoher Wirksamkeit。
- 专利标题： High cooling efficiency circuit module
- 专利标题（中）： Schaltkreismodul mitKühleinrichtungvon hoher Wirksamkeit。
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申请号： EP84302756.6申请日： 1984-04-24
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公开(公告)号： EP0129966A1公开(公告)日： 1985-01-02
- 发明人: August, Melvin C. , Williams, John T.
- 申请人： Cray Research, Inc.
- 申请人地址： 608 Second Avenue South Minneapolis Minnesota 55420 US
- 专利权人： Cray Research, Inc.
- 当前专利权人： Cray Research, Inc.
- 当前专利权人地址： 608 Second Avenue South Minneapolis Minnesota 55420 US
- 代理机构： Newstead, Michael John
- 优先权： US487516 19830422; US599688 19840417
- 主分类号： H01L23/36
- IPC分类号： H01L23/36 ; H05K7/20
摘要：
@ The specification discloses a circuit module (10) having enhanced heat transfer and distribution characteristics which is particularly adapted for use in high speed electronic digital computers. The circuit module (10) includes a circuit board assembly (12) with a plurality of electronic devices (26) such as integrated circuits, mounted on a circuit board (28). The circuit board (28) includes conductive pads (42 and 44) and plated-through holes (46) forming a thermally conductive flow path from each electronic device (26) to the opposite side of the circuit board for more efficient heat transfer away from the module (10). The heat pads (42 and 44) and plated-through holes (46) are preferably connected with the ground plane ■ layer (36) ofthe circuit board (28) for better heat distribution as well.
公开/授权文献
- EP0129966B1 High cooling efficiency circuit module 公开/授权日：1988-03-02
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