发明公开
EP0155766A1 Method and apparatus for glueing corrugated board
失效
Verfahren und Vorrichtung zum Kleben von Wellpappe。
- 专利标题： Method and apparatus for glueing corrugated board
- 专利标题（中）： Verfahren und Vorrichtung zum Kleben von Wellpappe。
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申请号： EP85301095.7申请日： 1985-02-19
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公开(公告)号： EP0155766A1公开(公告)日： 1985-09-25
- 发明人: Mori, Kazuo C/O Mori Shigyo Co., Ltd. , Isowa, Eiichi C/O Isowa Industry Co., Ltd.
- 申请人： ISOWA INDUSTRY CO. LTD.
- 申请人地址： 18 Houtoku-cho Kita-ku Nagoya Aichi JP
- 专利权人： ISOWA INDUSTRY CO. LTD.
- 当前专利权人： ISOWA INDUSTRY CO. LTD.
- 当前专利权人地址： 18 Houtoku-cho Kita-ku Nagoya Aichi JP
- 代理机构： Ben-Nathan, Laurence Albert
- 优先权： JP30899/84 19840220
- 主分类号： B31F1/20
- IPC分类号： B31F1/20
摘要：
@ A method for glueing corrugated board and an apparatus for carrying out same, wherein starch glue (34) is heated to a predetermined temperature range by heat exchange; the starch glue is supplied to a glue pan (32) placed in a hot atmosphere of a heat-insulated space (120) to maintain the glue in heated state; a corrugated core sheet (10) and a liner (12) are fed into the heat-insulated space; the heated starch glue is applied on ridge portions of the corrugated core sheet (10); and the corrugated core sheet and liner are bonded together.
公开/授权文献
- EP0155766B2 Method and apparatus for glueing corrugated board 公开/授权日：1991-04-10
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