发明公开
- 专利标题： INTEGRATED CIRCUITS WITH CONTACT PADS IN A STANDARD ARRAY.
- 专利标题（中）： 在一个标准的程序接口触点的集成电路。
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申请号： EP85901784申请日： 1985-03-19
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公开(公告)号： EP0179802A4公开(公告)日： 1987-06-01
- 发明人: QUINN DANIEL J , MULHOLLAND WAYNE A , BOND ROBERT H , OLLA MICHAEL A , CUPPLES JERRY S , TSITOVSKY ILYA L , MOZDZEN BARBARA R , HELD CHARLES F , WILSON LINDA S , NGUYEN YEN T
- 申请人： MOSTEK CORP
- 专利权人： MOSTEK CORP
- 当前专利权人： MOSTEK CORP
- 优先权： US59218684 1984-03-22
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L23/485 ; H01L25/16 ; H01L21/92 ; H01L23/50
摘要：
An integrated circuit chip (310) includes a top layer of dielectric (320) penetrated by conductive vias (305) connecting electrical contacts (304) within the integrated circuit proper to a network of electrical leads (326) disposed on top of the dielectric layer (320); the network of leads (326), in turn, being connected to an array of contact pads (330) adapted for simultaneous solder connection to a leadframe.
信息查询
IPC分类:
