公开(公告)号：EP4220693B1

公开(公告)日：2024-11-06

申请号：EP23153889.3

申请日：2023-01-30

发明人： MAZZOLA, Mauro ,  MARCHISI, Fabio

IPC分类号： H01L21/60 ,  H01L23/492

公开(公告)号：EP4139954B1

公开(公告)日：2024-10-16

申请号：EP21933642.7

申请日：2021-03-30

发明人： CHEN, He

IPC分类号： H01L21/60 ,  H01L21/265 ,  H01L21/762 ,  H01L21/20 ,  H10B43/40

公开(公告)号：EP3417479B1

公开(公告)日：2024-10-16

申请号：EP17705467.3

申请日：2017-02-09

发明人： DAVIES, Neil ,  PRICE, Richard David ,  DEVENPORT, Stephen ,  SPEAKMAN, Stuart, Philip

IPC分类号： H01L21/67 ,  H01L21/60

公开(公告)号：EP4430662A2

公开(公告)日：2024-09-18

申请号：EP23702229.8

申请日：2023-01-12

申请人： Siemens Aktiengesellschaft

发明人： HENSEL, Alexander ,  STEGMEIER, Stefan ,  WAGNER, Claus Florian ,  WOITON, Michael

IPC分类号： H01L23/485 ,  H01L23/49 ,  H01L21/60 ,  C23C4/08 ,  C23C4/123 ,  C23C4/134 ,  C23C28/02 ,  C23C4/02 ,  C23C4/06 ,  C23C4/129 ,  C23C4/131 ,  C23C24/04 ,  C23C24/08

CPC分类号： H01L2224/7326520130101 ,  H01L2224/8380120130101 ,  H01L2224/838420130101 ,  H01L2224/4514720130101 ,  H01L24/72 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/0382120130101 ,  H01L2224/0574720130101 ,  H01L2224/057820130101 ,  H01L2224/8537920130101 ,  H01L2224/0407320130101 ,  H01L2224/0404220130101 ,  H01L2224/0589520130101 ,  H01L2224/8521420130101 ,  H01L2924/35120130101 ,  H01L24/45 ,  H01L24/73 ,  H01L2924/0001420130101 ,  H01L2224/4501420130101 ,  H01L2224/3318120130101 ,  H01L2924/1305520130101 ,  H01L2924/1027220130101 ,  H01L2924/1025320130101 ,  H01L2924/103320130101 ,  C23C4/08 ,  H01L24/32 ,  H01L24/83 ,  H01L24/85 ,  H01L24/48 ,  H01L2224/0618120130101 ,  H01L2224/060320130101 ,  H01L24/06 ,  C23C28/028 ,  C23C28/023 ,  C23C4/134 ,  C23C4/129 ,  C23C4/131 ,  C23C24/04 ,  C23C24/08 ,  C23C4/06 ,  C23C4/02

公开(公告)号：EP4416758A2

公开(公告)日：2024-08-21

申请号：EP22803184.5

申请日：2022-10-13

申请人： PINK GmbH Thermosysteme

发明人： OETZEL, Christoph

IPC分类号： H01L21/67 ,  H01L23/00 ,  H01L21/60

CPC分类号： H01L24/75 ,  H01L2224/7530520130101 ,  H01L2224/753120130101 ,  H01L2224/7510220130101 ,  H01L2224/756520130101 ,  H01L2224/7525120130101 ,  H01L2224/7525220130101 ,  H01L2224/7550120130101 ,  H01L2224/7550220130101 ,  H01L2224/7582420130101 ,  H01L2224/7531420130101 ,  H01L2224/7531520130101 ,  H01L2224/7531320130101 ,  H01L24/83 ,  H01L2224/759820130101 ,  H01L2224/7531620130101 ,  H01L2224/838420130101 ,  H01L2224/9520130101 ,  H01L2224/838220130101 ,  H01L2224/8320920130101 ,  H01L2224/3224520130101 ,  H01L24/95

公开(公告)号：EP3357086B1

公开(公告)日：2024-08-07

申请号：EP16852270.4

申请日：2016-08-26

IPC分类号： H01L23/64 ,  H01L23/48 ,  H01L23/50 ,  H01L25/065 ,  H01L21/98 ,  H01L21/60

CPC分类号： H01L23/642 ,  H01L2225/0653120130101 ,  H01L23/48 ,  H01L24/29 ,  H01L2224/2918620130101 ,  H01L2224/3214520130101 ,  H01L2224/8089620130101 ,  H01L2224/0361420130101 ,  H01L24/03 ,  H01L24/80 ,  H01L2224/03420130101 ,  H01L2224/0360220130101 ,  H01L2224/0814520130101 ,  H01L2224/27420130101 ,  H01L2224/290820130101 ,  H01L2224/291920130101 ,  H01L2224/8319120130101 ,  H01L2224/8319320130101 ,  H01L2224/2760220130101 ,  H01L2224/0812120130101 ,  H01L2224/8090120130101 ,  H01L24/72 ,  H01L24/27 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/2761420130101 ,  H01L2224/8389620130101 ,  H01L2224/0300920130101 ,  H01L21/2007

公开(公告)号：EP4141924B1

公开(公告)日：2024-07-24

申请号：EP22193090.2

申请日：2022-08-31

IPC分类号： H01L23/488 ,  H01L21/60 ,  H01L23/00 ,  B23K35/26 ,  B23K35/28

CPC分类号： H01L24/32 ,  H01L24/83 ,  H01L24/29 ,  H01L2224/8382520130101 ,  H01L2224/838120130101 ,  H01L2224/3250720130101 ,  H01L2224/8390720130101 ,  H01L2224/8306520130101 ,  H01L2224/8321120130101 ,  H01L2224/2901720130101 ,  H01L2224/8301120130101 ,  H01L2224/8302220130101 ,  H01L2224/8310120130101 ,  H01L2224/2901920130101 ,  H01L2224/9520130101 ,  H01L2224/3222720130101 ,  H01L2224/3224520130101 ,  H01L2224/0402620130101 ,  H01L2224/271120130101 ,  H01L2224/29120130101 ,  H01L24/27 ,  H01L24/95 ,  H01L2224/3205720130101 ,  B23K35/26 ,  B23K35/262 ,  B23K35/264 ,  B23K35/266 ,  B23K35/282 ,  H01L24/05 ,  H01L2224/0517220130101 ,  H01L2224/2910120130101 ,  H01L2224/2913920130101 ,  H01L2224/2911820130101 ,  H01L2224/0564420130101 ,  H01L2224/8345520130101 ,  H01L2224/0513820130101 ,  H01L2224/0566920130101 ,  H01L2224/2910520130101 ,  H01L2224/8344420130101 ,  H01L2224/8347220130101 ,  H01L2224/0565520130101 ,  H01L2224/0563920130101 ,  H01L2224/0567220130101 ,  H01L2224/2910920130101 ,  H01L2224/8346420130101 ,  H01L2224/0515520130101 ,  H01L2224/0564720130101 ,  H01L2224/8343920130101 ,  H01L2224/8346920130101 ,  H01L2224/0566420130101 ,  H01L2224/2914720130101 ,  H01L2224/0516420130101 ,  H01L2224/8344720130101 ,  H01L2224/2911320130101 ,  H01L2224/291220130101 ,  H01L2224/2911120130101 ,  H01L2224/2914420130101

公开(公告)号：EP4397731A1

公开(公告)日：2024-07-10

申请号：EP22864471.2

申请日：2022-08-29

申请人： Toray Industries, Inc.

发明人： ARIMOTO, Yukari ,  FUJIWARA, Takenori ,  ARAKI, Hitoshi

IPC分类号： C09J11/06 ,  C09J163/00 ,  C09J179/08 ,  H01L21/60

CPC分类号： H01L21/60 ,  C09J11/06 ,  C09J163/00 ,  C09J179/08

摘要： The present invention aims to provide a pressure sensitive adhesive having high pressure sensitive adhesiveness and heat resistance and serves to makes it possible to transfer and mount a large number of semiconductor elements at once even when the process involves a step for applying heat to the semiconductor elements. It provides a pressure sensitive adhesive including a polyimide copolymer (A) having at least an acid dianhydride residue and a diamine residue and also comprising a dimer acid epoxy resin (B), wherein the diamine residue has a diamine residue (A1) as represented by the formula (1) in which n is a natural number of 1 or more and 15 or less (hereinafter referred to as the diamine residue (A1)), a diamine residue (A2) as represented by the formula (1) in which n is a natural number of 16 or more and 50 or less (hereinafter referred to as the diamine residue (A2)), and a diamine residue (A3) having a phenolic hydroxyl group (hereinafter referred to as the diamine residue (A3)) and also wherein the diamine residue (A1) accounts for 50.0 mol% or more and 95.0 mol% or less, the diamine residue (A2) accounting for 1.0 mol% or more and 40.0 mol% or less, and the diamine residue (A3) accounting for 1.0 mol% or more and 30.0 mol% or less, of all diamine residues, which account for 100.0 mol%, in the polyimide copolymer (A).

公开(公告)号：EP4325552A3

公开(公告)日：2024-07-10

申请号：EP23219820.0

申请日：2019-05-03

申请人： Intel Corporation

发明人： SANKMAN, Robert ,  AGRGHARAM, Sairam ,  WANG, Guotao ,  OU, Shengquan ,  DE BONIS, Thomas ,  SPENCER, Todd ,  SUN, Yang

IPC分类号： H01L21/60 ,  H01L25/065 ,  H01L21/98 ,  H01L21/56 ,  H01L23/31 ,  H01L23/538

CPC分类号： H01L23/3128 ,  H01L23/3135 ,  H01L21/56 ,  H01L21/568 ,  H01L23/5385 ,  H01L23/49816 ,  H01L23/5389 ,  H01L25/0655 ,  H01L2224/132920130101 ,  H01L2224/13320130101 ,  H01L2224/0822520130101 ,  H01L2224/0410520130101 ,  H01L2224/920220130101 ,  H01L2224/1210520130101 ,  H01L2224/9720130101 ,  H01L2224/1622720130101 ,  H01L2224/8198620130101 ,  H01L24/95 ,  H01L24/81 ,  H01L24/16 ,  H01L24/17 ,  H01L2224/8119220130101 ,  H01L2224/8119120130101 ,  H01L2224/170320130101 ,  H01L2224/8100520130101 ,  H01L2224/9500120130101 ,  H01L2224/3224520130101 ,  H01L2224/7325320130101 ,  H01L2224/7320920130101 ,  H01L2924/1816220130101 ,  H01L2924/1816120130101 ,  H01L24/96 ,  H01L2224/7320420130101 ,  H01L2224/3222520130101 ,  H01L25/0652 ,  H01L2224/0618120130101 ,  H01L2224/055720130101 ,  H01L2225/0651320130101 ,  H01L2225/0651720130101 ,  H01L2225/0654120130101 ,  H01L2225/0656220130101 ,  H01L2225/0658620130101 ,  H01L2224/0814520130101 ,  H01L2224/1614520130101 ,  H01L2924/1625120130101 ,  H01L2224/8203920130101 ,  H01L2223/5442620130101 ,  H01L2224/9222420130101 ,  H01L24/19 ,  H01L2924/1519220130101 ,  H01L25/50 ,  H01L2224/13120130101 ,  H01L2224/7325120130101 ,  H01L2224/040120130101 ,  H01L2224/1718120130101 ,  H01L24/73 ,  H01L24/08

摘要： An electronic device may include a first die that may include a first set of die contacts. The electronic device may include a second die that may include a second set of die contacts. The electronic device may include a bridge interconnect that may include a first set of bridge contacts and may include a second set of bridge contacts. The first set of bridge contacts may be directly coupled to the first set of die contacts (e.g., with an interconnecting material, such as solder). The second set of bridge contacts may be directly coupled to the second set of die contacts (e.g., with solder). The bridge interconnect may help facilitate electrical communication between the first die and the second die.

公开(公告)号：EP3847694B1

公开(公告)日：2024-06-19

申请号：EP19774162.2

申请日：2019-09-02

IPC分类号： H01L23/48 ,  H01L21/60 ,  H01L23/492 ,  H01L25/07 ,  H01L25/16 ,  H01L23/373

CPC分类号： H01L23/3735 ,  H01L23/492 ,  H01L24/08 ,  H01L24/80 ,  H01L24/94 ,  H01L25/072 ,  H01L25/16 ,  H01L2224/0564720130101 ,  H01L2224/0618120130101 ,  H01L2224/0825820130101 ,  H01L2224/8020320130101 ,  H01L2224/8044720130101 ,  H01L2224/8089520130101 ,  H01L2224/9420130101