BONDING WIRE
    3.
    发明公开
    BONDING WIRE 审中-公开

    公开(公告)号:EP4495982A1

    公开(公告)日:2025-01-22

    申请号:EP23932298.5

    申请日:2023-06-27

    Abstract: There is provided a novel alloy-coated Cu bonding wire that achieves a favorable FAB shape and also a favorable initial bondability of a 2nd bonding part including adhesion of the 2nd bonding part, and that reduces a galvanic corrosion in a high-temperature environment to achieve a favorable bond reliability of the 2nd bonding part. The alloy-coated Cu bonding wire includes a core material of Cu or Cu alloy, and a coating layer having a total concentration of Pd and Ni of 90 atomic% or more formed on a surface of the core material. The bonding wire is characterized in that:
    in a concentration profile in a depth direction of the wire obtained by performing measurement using Auger electron spectroscopy (AES) so that the number of measurement points in the depth direction is 50 or more for the coating layer,
    a thickness of the coating layer is 10 nm or more and 130 nm or less,
    an average value X is 0.1 or more and 35.0 or less, the average value X being defined as an average value of a ratio of a Pd concentration C Pd (atomic%) to an Ni concentration C Ni (atomic%), C Pd /C Ni , for all measurement points in the coating layer,
    the total number of measurement points in the coating layer whose absolute deviation from the average value X is 0.3X or less is 50% or more relative to the total number of measurement points in the coating layer, and
    the bonding wire satisfies the following condition (A) :
    (A) the bonding wire contains one or more elements selected from the group consisting of Ti, V, Cr, Mn, Fe, Co, Zn, Zr, Nb, Mo, Ru, Rh, Sn, Ta, W, Os, Ir, Pt, Au and Bi (hereinafter referred to as "first additive element"), and the total concentration of the first additive element relative to the entire wire is 5 ppm by mass or more and 450 ppm by mass or less.

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