发明公开
EP0180265A1 Method of autocatalytically tin-plating articles of copper or a copper alloy
失效
Verfahren zur autokatalytischen Verzinnung von Kupfer- undKupferlegierungsgegenständen。
- 专利标题： Method of autocatalytically tin-plating articles of copper or a copper alloy
- 专利标题（中）： Verfahren zur autokatalytischen Verzinnung von Kupfer- undKupferlegierungsgegenständen。
-
申请号： EP85201585.8申请日： 1985-10-02
-
公开(公告)号： EP0180265A1公开(公告)日： 1986-05-07
- 发明人: Molenaar, Arian , Coumans, Jacobus Johannes Chretien , Meenderink, Brigitta Christina Maria
- 申请人： Philips Electronics N.V.
- 申请人地址： Groenewoudseweg 1 5621 BA Eindhoven NL
- 专利权人： Philips Electronics N.V.
- 当前专利权人： Philips Electronics N.V.
- 当前专利权人地址： Groenewoudseweg 1 5621 BA Eindhoven NL
- 代理机构： Weening, Cornelis (NL)
- 优先权： NL8403033 19841005
- 主分类号： C23C18/46
- IPC分类号： C23C18/46
摘要：
Improvement of an electroless tin-plating method of articles of copper or of a copper alloy with a strongly alkaline solution which contains at least 0.20 mol/litre of bivalent tin ions and at least 1 mol/litre of alkalihydroxide at a temperature between 60 and 95 °C. The improvement consists of a pre-treatment with an acid solution of a bivalent tin salt and a complex former for Cu ++ and/or Sn ++ ions with which a layer of copper at the surface is exchanged for tin. The complex former preferably is thiourea.
公开/授权文献
信息查询
