发明公开
- 专利标题： Barrierless high-temperature Lift-off process for forming a patterned interconnection layer
- 专利标题（中）： 形成图形互连层的无障碍高温提升过程
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申请号： EP86105142申请日： 1986-04-15
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公开(公告)号： EP0200082A3公开(公告)日： 1988-11-17
- 发明人: Clodgo, Donna Jean , Previti-Kelly, Rosemary Ann , Walton, Erick Gregory
- 申请人： International Business Machines Corporation
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 优先权： US728072 19850430
- 主分类号： H01L21/90
- IPC分类号： H01L21/90
摘要：
A lift-off metal deposition process in which a high-temperature polyimide layer (16) (i.e. a polyimide having a high imidization temperature) is applied to a first polyimide layer (14). The two layers (14, 16) are anisotropically etched through a photoresist mask to form via holes in the first polyimide layer (14). After application of a metal layer (20), the high-temperature polyimide layer (16) is lifted off the first polyimide layer (14), which remains as a passivation layer.
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