发明授权
- 专利标题: Plating bath and method for electroplating tin and/or lead
- 专利标题(中): 用于电镀锡和/或铅的镀锌浴和方法
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申请号: EP86304948.2申请日: 1986-06-25
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公开(公告)号: EP0207732B1公开(公告)日: 1992-02-12
- 发明人: Opaskar, Vincent C. , Bokisa, George S.
- 申请人: MCGEAN-ROHCO, INC.
- 申请人地址: 1250 Terminal Tower Cleveland Ohio 44113 US
- 专利权人: MCGEAN-ROHCO, INC.
- 当前专利权人: MCGEAN-ROHCO, INC.
- 当前专利权人地址: 1250 Terminal Tower Cleveland Ohio 44113 US
- 代理机构: Lamb, John Baxter
- 优先权: US749176 19850626; US826849 19860206
- 主分类号: C25D3/32
- IPC分类号: C25D3/32 ; C25D3/36 ; C25D3/60
公开/授权文献
- EP0207732A1 Plating bath and method for electroplating tin and/or lead 公开/授权日:1987-01-07
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