发明公开
- 专利标题： Electronic component package
- 专利标题（中）： 电子元件包装
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申请号： EP86309867申请日： 1986-12-17
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公开(公告)号： EP0228869A3公开(公告)日： 1987-09-16
- 发明人: Moyer, Harold William , Scholz, Harry Robert
- 申请人： AMERICAN TELEPHONE AND TELEGRAPH COMPANY
- 专利权人： AMERICAN TELEPHONE AND TELEGRAPH COMPANY
- 当前专利权人： AMERICAN TELEPHONE AND TELEGRAPH COMPANY
- 优先权： US816443 19860106
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
Disclosed is a semiconductor package with a high pin count. External contacts to the chip are provided by interdigitated leads (l3, l4 - l6, l7) formed from an upper (l5) and lower (l2) lead frame. The lower lead frame includes a paddle (ll) for mounting the chip (l0). The upper lead frame initially has its leads tied together (30-33) and a center portion is punched out to fit the size of the particular chip. The two lead frames are preferably coplanar in the area around the boundaries of the package encapsulant.
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