发明公开
- 专利标题： Thermal conduction device
- 专利标题（中）： 导热装置
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申请号： EP87101348申请日： 1987-02-02
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公开(公告)号： EP0237741A3公开(公告)日： 1987-12-02
- 发明人: Nakajima, Tadakatsu 7-301 Tsukuba House , Nakayama, Wataru , Oohashi, Shigeo Niihari-ryo , Kuwabara, Heikichi , Daikoku, Takahiro
- 申请人： HITACHI, LTD.
- 专利权人： HITACHI, LTD.
- 当前专利权人： HITACHI, LTD.
- 优先权： JP6055886 19860320
- 主分类号： H01L23/42
- IPC分类号： H01L23/42 ; H01L23/36
摘要：
The present invention relates to a thermal conduction device well suited to cool electronic components such as semiconductor devices, in which a porous layer (11) is provided at the surface part of the contact interface of a heat generating element (1) or a heat sink element (2), and a liquid (13) such as oil is contained in cavities (15) formed in the porous layer (11), the heat generating element (1) and the heat sink element (2) being held in close contact by the surface tension of the liquid (13), whereby heat generated by the heat generating element (1) is transferred to the heat sink element (2).
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