公开(公告)号：EP3926669B1

公开(公告)日：2024-11-13

申请号：EP21176533.4

申请日：2021-05-28

发明人： IYENGAR, Madhusudan K. ,  MALONE, Christopher ,  KWON, Woon-Seong ,  SAMADIANI, Emad ,  BEAUCHEMIN, Melanie ,  JAIN, Padam ,  KANG, Teckgyu ,  LI, Yuan ,  BURGESS, Connor ,  JOUPPI, Norman Paul ,  STEVENS-YU, Nicholas ,  WANG, Yingying

IPC分类号： H01L23/367 ,  H01L23/467 ,  H01L23/473 ,  H01L23/36 ,  H01L23/42 ,  H01L23/498 ,  H01L23/538 ,  H01L23/00 ,  H05K7/20 ,  H01L25/065

公开(公告)号：EP4057337B1

公开(公告)日：2024-08-28

申请号：EP22152268.3

申请日：2022-01-19

IPC分类号： H01L23/36 ,  H01L23/24 ,  H01L23/42

CPC分类号： H01L23/36 ,  H01L23/42 ,  H01L23/3135 ,  H01L23/24 ,  H01L23/04

公开(公告)号：EP4407674A1

公开(公告)日：2024-07-31

申请号：EP23206846.0

申请日：2023-10-30

申请人： Acer Incorporated

发明人： WANG, Yu-Shih ,  LIU, Chih-Chun ,  LING, Cheng-Nan ,  TAI, Wen-Chieh

IPC分类号： H01L23/373 ,  H01L23/42 ,  H01L23/433 ,  H01L23/40 ,  H01L29/06

CPC分类号： H01L23/3736 ,  H01L23/3733 ,  H01L23/42 ,  H01L23/4006 ,  H01L23/433 ,  H01L29/0657

摘要： The invention provides an electronic package module (100) including a chip (111), a heat-dissipation component (120), a carrying member (130), and a liquid metal (140). The carrying member (130) is clamped between the chip (111) and the heat-dissipation component (120). The carrying member (130) has a porous structure. The liquid metal (140) is filled in the porous structure to be in thermal contact with the chip (111) and the heat-dissipation component (120). The liquid metal (140) is constrained between the chip (111) and the heat-dissipation component (120) by the carrying member (130) and does not flow outside of the chip (111) and the heat-dissipation component (120).

公开(公告)号：EP3758058B1

公开(公告)日：2024-07-17

申请号：EP20165695.6

申请日：2020-03-25

IPC分类号： H01L23/42 ,  H01L23/433

CPC分类号： H01L23/42 ,  H01L23/433 ,  H01L2224/1718120130101 ,  H01L2224/7320420130101 ,  H01L2224/7325320130101 ,  H01L2224/1622720130101 ,  H01L2924/1531120130101 ,  H01L2924/1625120130101 ,  H01L2924/16320130101 ,  H01L24/29 ,  H01L2224/3222520130101 ,  H01L2224/3318120130101 ,  H01L2924/163120130101 ,  H01L2224/291920130101 ,  H01L2224/3201320130101 ,  H01L2224/3205820130101 ,  H01L2224/0402620130101 ,  H01L24/05 ,  H01L2224/3250320130101 ,  H01L2224/0556720130101 ,  H01L24/13 ,  H01L2224/13120130101 ,  H01L2224/1311120130101 ,  H01L24/16 ,  H01L24/32 ,  H01L2224/039120130101 ,  H01L24/17 ,  H01L24/33 ,  H01L2224/1624520130101 ,  H01L2224/3224520130101 ,  H01L2924/1615220130101 ,  H01L2924/17320130101 ,  H01L2224/8319120130101 ,  H01L2224/8119220130101 ,  H01L2224/7310420130101 ,  H01L24/14 ,  H01L2224/1413120130101 ,  H01L2224/1413320130101 ,  H01L2224/141620130101 ,  H01L24/73 ,  H01L2924/1531220130101 ,  H01L2924/1531320130101 ,  H01L2224/140320130101 ,  H01L2224/141420130101 ,  H01L2224/1301420130101 ,  H01L2224/1301320130101 ,  H01L2224/1301220130101 ,  H01L2224/3350520130101 ,  H01L2224/1405120130101 ,  H01L2224/2743620130101 ,  H01L2224/2731220130101 ,  H01L2224/274720130101 ,  H01L2224/8386220130101 ,  H01L2224/8387420130101 ,  H01L2224/9222220130101 ,  H01L2224/9224220130101 ,  H01L24/27 ,  H01L24/92 ,  H01L24/11 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/8181520130101 ,  H01L2224/1710620130101 ,  H01L23/367 ,  H01L2224/1310920130101 ,  H01L2224/8344720130101 ,  H01L2224/8144720130101 ,  H01L2224/8139920130101 ,  H01L2224/1313920130101 ,  H01L2224/1314720130101 ,  H01L2924/35120130101 ,  H01L2924/351220130101

公开(公告)号：EP4372805A1

公开(公告)日：2024-05-22

申请号：EP22216766.0

申请日：2022-12-27

申请人： Micro-Star Int'l Co., Limited ,  MSI Computer (Shenzhen) Co., Ltd.

发明人： CHEN, Cheng-Lung ,  CHANG, Chia-Ming

IPC分类号： H01L23/42 ,  H01L23/427 ,  C09K5/06

CPC分类号： H01L23/4275 ,  H01L23/42 ,  C09K5/063

摘要： The disclosure provides electronic assembly (10), method for manufacturing electronic assembly, and composite thermally conductive sheet (20b). The electronic assembly includes circuit board (100), heat source (200), anti-overflow element (300), thermally conductive block (400) and thermally conductive sheet (500). The heat source is disposed on and electrically connected to the circuit board. The anti-overflow element is disposed on a side of the heat source located farthest away from the circuit board and has an opening (303). The thermally conductive block is disposed on a side of the anti-overflow element located farthest away from the heat source. The thermally conductive sheet is made of a phase change material. The thermally conductive sheet is located in the opening of the anti-overflow element to be surrounded by the anti-overflow element. Opposite sides of the thermally conductive sheet are in thermal contact with the heat source and the thermally conductive block, respectively.

公开(公告)号：EP3726573B1

公开(公告)日：2024-03-20

申请号：EP19906601.0

申请日：2019-10-02

发明人： SHIBUYA, Hitoshi

IPC分类号： C09K5/14 ,  H01L23/42 ,  H01L23/373 ,  C08L83/04 ,  C08G77/12 ,  C08G77/20 ,  C08K3/22 ,  C09D183/04 ,  C08K3/08

公开(公告)号：EP4300571A1

公开(公告)日：2024-01-03

申请号：EP22181245.6

申请日：2022-06-27

申请人： Infineon Technologies Austria AG

发明人： BOHNENBERGER, Timo ,  HEINRICH, Alexander ,  WILLE, Catharina

IPC分类号： H01L23/373 ,  H01L23/42 ,  H01L21/48

摘要： A power semiconductor module arrangement comprises a power semiconductor module (100), wherein the power semiconductor module (100) comprises a substrate (10), and a heat-conducting layer (40) arranged on a lower surface of the power semiconductor module (100), wherein the lower surface of the power semiconductor module (100) is a surface that is configured to be mounted to a heat sink (30), wherein the heat-conducting layer (40) consists of a metallic foam (402) and an eutectic material (404) filling the cavities within the metallic foam (402).

公开(公告)号：EP4270471A2

公开(公告)日：2023-11-01

申请号：EP23196641.7

申请日：2021-02-24

申请人： Arieca Inc.

发明人： Kazem, Navid ,  Majidi, Carmel

IPC分类号： H01L23/42

摘要： The present disclosure relates to an integrated circuit assembly that comprises a die, an upper layer and a thermal interface material. The thermal interface material is disposed in contact with the die and the upper layer. The thermal interface material comprises a polymer and liquid metal droplets dispersed throughout the polymer. A bondline distance formed between the die and the upper layer is no greater than 150 microns. The liquid metal droplets are in a liquid phase at least at a temperature in a range of -19 degrees Celsius to 30 degrees Celsius. The polymer is elastomeric.

公开(公告)号：EP3817529B1

公开(公告)日：2023-10-04

申请号：EP18924944.4

申请日：2018-06-27

发明人： MIYAMOTO, Takashi ,  YASUDA, Naoki ,  OKADA, Shinichi ,  KUSANO, Ryota

IPC分类号： H05K7/20 ,  H05K7/12 ,  H01L23/367 ,  H01L23/373 ,  H01L23/40 ,  H01L23/42

公开(公告)号：EP4235244A1

公开(公告)日：2023-08-30

申请号：EP22305205.1

申请日：2022-02-24

申请人： Nokia Solutions and Networks Oy

发明人： SHEN, Alexandre ,  ENRIGHT, Ryan ,  NEEL, Delphine ,  BITAULD, David

IPC分类号： G02B6/42 ,  H01S5/0239 ,  H01L23/367 ,  H01S5/024 ,  H01L23/38 ,  H01L23/42

摘要： The present application relates to EIC-INTEGRATED PICs. More particularly, various embodiments relate to EIC-INTEGRATED PICs enabling effective thermal management temperature control and heat removal.