An improved integrated circuit chips cooling module (100) in which a cooling member (1) having an inside space through which a coolant flows is attached to each of the integrated circuit chips (2) by pressure welding or anchoring to effect cooling, wherein the improvement comprises providing coated portions for each portion of the surface of coolant flow system (5, 7, 10) where the coolant leakage may possibly take place, the coating of said coated portions comprising an organic or inorganic high-molecular compound (14) curable by reacting with the coolant to keep the latter from leakage.