摘要:
An information processing apparatus is made up of a plurality of modules (1, 2, 3, 4, 125, 126, 127, 128). One module is made up of a functional block for rapidly operating a scalar product and a control unit for controlling the functional block. The module operates itself in an SIMD manner. The plurality of modules are connected so as to communicate a signal with each other. The plurality of modules operate in an MIMD manner. Inside of one module, the strong fault tolerant parts such as a neuron processor (204) and a memory (202) are integrated on an integrated circuit substrate. The weak fault tolerant parts such as a control unit is mounted on the integrated circuit substrate by means of a silicon on silicon technique.
摘要:
An information processing apparatus is made up of a plurality of modules (1, 2, 3, 4, 125, 126, 127, 128). One module is made up of a functional block for rapidly operating a scalar product and a control unit for controlling the functional block. The module operates itself in an SIMD manner. The plurality of modules are connected so as to communicate a signal with each other. The plurality of modules operate in an MIMD manner. Inside of one module, the strong fault tolerant parts such as a neuron processor (204) and a memory (202) are integrated on an integrated circuit substrate. The weak fault tolerant parts such as a control unit is mounted on the integrated circuit substrate by means of a silicon on silicon technique.
摘要:
An information processing system includes a plurality of functional blocks (neurons) (100) and a data bus (300) for transmitting in common the outputs of the individual functional blocks (neurons). Data transaction among the functional blocks (neurons) is performed through the data bus on the time-division basis. For preventing the outputs from conflicting or competition, addresses are assigned to the individual blocks (neurons), respectively, so that only the functional block (neuron) having the own address designated by the address signal supplied through an address bus (302) outputs data signal onto the data bus, while the other functional blocks (neurons) receive the information on the data bus as the signal originating in the functional block whose address is designated at that time point. The addresses are sequentially changed. During a round of the addresses signals, data are transmitted from given functional blocks (neurons) to other given functional blocks (neurons).
摘要:
An integrated circuit device has a wiring substrate (2) on one surface of which integrated circuit chips (l) are mounted. A power source substrate (5) of a laminated structure is in contact with the opposite surface of the wiring substrate (2), the power source substrate being of alternate laminations of conductor layers (7) of a heat conductive metal and insulating layers (6) of an electrically insulating material, which layers are bonded together. Means such as pins (4) electrically connect the wiring substrate and the power source substrate to each other, and hence connect the chips (l) to the conductive layers (7), a heat radiating means is provided in at least one of either or both of the conductor layers (7) and the insulating layers (6) and radiates heat, which occurs in the power source substrate (5), to the exterior of the device. Such an integrated circuit device has a power source substrate (5) of a remarkably high heat radiating efficiency, and may permit a high density of integrated circuit chips (l) on the wiring substrate (2).
摘要:
@ Disclosed is a cooling structure cooling a multichip module for effectively removing heat generated from integrated circuit chips. A suction plate (30) formed with minute grooves (31) on one of its surfaces is disposed between each of the integrated circuit chip (2) and an associated cooling block (20) and is brought into contact at the grooved surface with the integrated circuit chip through a layer of a liquid (200) such as silicone oil interposed therebetween, thereby producing negative hydrostatic pressure by the capillary action of the grooves. The suction plate (30) has a thickness small enough to be bent under influence of the negative hydrostatic pressure to follow up warping of the integrated circuit chip, so that the clearance between the opposing surfaces of the suction plate and the integrated circuit chip can be minimized. An integrated circuit chip cooling device of surface-to-surface contact type operable with a low thermal resistance is provided, which can improve the maintainability and reliability without sacrificing the cooling efficiency.
摘要:
An information processing system includes a plurality of functional blocks (neurons) (100) and a data bus (300) for transmitting in common the outputs of the individual functional blocks (neurons). Data transaction among the functional blocks (neurons) is performed through the data bus on the time-division basis. For preventing the outputs from conflicting or competition, addresses are assigned to the individual blocks (neurons), respectively, so that only the functional block (neuron) having the own address designated by the address signal supplied through an address bus (302) outputs data signal onto the data bus, while the other functional blocks (neurons) receive the information on the data bus as the signal originating in the functional block whose address is designated at that time point. The addresses are sequentially changed. During a round of the addresses signals, data are transmitted from given functional blocks (neurons) to other given functional blocks (neurons).