发明公开
- 专利标题： Wire-bonding method
- 专利标题（中）： Verfahren zum Verbinden eines Drahtes。
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申请号： EP87112737.9申请日： 1987-09-01
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公开(公告)号： EP0258869A2公开(公告)日： 1988-03-09
- 发明人: Yamanaka, Kazuyuki , Shibasaka, Mitsusada
- 申请人： KABUSHIKI KAISHA TOSHIBA
- 申请人地址： 72, Horikawa-cho, Saiwai-ku Kawasaki-shi, Kanagawa-ken 210 JP
- 专利权人： KABUSHIKI KAISHA TOSHIBA
- 当前专利权人： KABUSHIKI KAISHA TOSHIBA
- 当前专利权人地址： 72, Horikawa-cho, Saiwai-ku Kawasaki-shi, Kanagawa-ken 210 JP
- 代理机构： Lehn, Werner, Dipl.-Ing.
- 优先权： JP206553/86 19860902
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L21/60
摘要：
Wire-bonding of a semiconductor device designed in accordance with the CAD system is implemented on the basis of bonding data obtained by making use of the design data in the CAD system. For the design data in the CAD system, coordinate data of the bonding pads and the lead frames and wiring information therebetween are used. Since ordinarily the coordinate system in the CAD system and the coordinate system in the wire-bonding apparatus are not equal to each other, coordinate transformation is applied to the bonding data obtained from the CAD system. The data thus transformed is delivered to the bonding unit. Since there is employed a scheme to utilize the design data in the CAD system, the necessity of inputting bonding data by an operator is eliminated, thus making it possible to carry out bonding work free from an error in a short time.
公开/授权文献
- EP0258869B1 Wire-bonding method 公开/授权日：1994-05-18
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