发明公开
EP0289421A3 Non-contact sensing and controlling of spacing between a depositing tip and each selected depositing location on a substrate
失效
非接触式感应和控制位置在沉积位置和每个选定的沉积位置在基板之间
- 专利标题： Non-contact sensing and controlling of spacing between a depositing tip and each selected depositing location on a substrate
- 专利标题（中）： 非接触式感应和控制位置在沉积位置和每个选定的沉积位置在基板之间
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申请号： EP88401033.1申请日： 1988-04-27
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公开(公告)号： EP0289421A3公开(公告)日： 1990-07-25
- 发明人: Burgin, John I., Jr. , Kane, Michael Joseph , Levie, Michael M.
- 申请人： UNIVERSAL INSTRUMENTS CORPORATION (Delaware Corp.)
- 申请人地址： P.O. Box 825 Binghamton New York 13902-0825 US
- 专利权人： UNIVERSAL INSTRUMENTS CORPORATION (Delaware Corp.)
- 当前专利权人： UNIVERSAL INSTRUMENTS CORPORATION (Delaware Corp.)
- 当前专利权人地址： P.O. Box 825 Binghamton New York 13902-0825 US
- 代理机构： Rodhain, Claude (FR)
- 优先权： US43623 19870428
- 主分类号： B23Q15/24
- IPC分类号： B23Q15/24 ; B05C11/10
摘要：
It comprises positioning of a material depositing tip (22) a preferred distance from this location on the substrate (14) according to such sensing and in preparation for the depositing. Preferably, the tip (22) is advanced to a preferred spacing between it and the substrate (14), without overshooting the spacing and without contacting the substrate (14), in preparation for depositing.
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