发明公开
EP0297678A1 Conductive metallization of substrates without developing agents
失效
Leitungsmetallisierung von Substraten ohne Entwicklungsmittel。
- 专利标题： Conductive metallization of substrates without developing agents
- 专利标题（中）： Leitungsmetallisierung von Substraten ohne Entwicklungsmittel。
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申请号： EP88201343.6申请日： 1988-06-29
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公开(公告)号： EP0297678A1公开(公告)日： 1989-01-04
- 发明人: Parr, William John E , Moy, Paul Yuet Yee , Frank, Dieter
- 申请人： AKZO N.V.
- 申请人地址： Velperweg 76 NL-6824 BM Arnhem NL
- 专利权人： AKZO N.V.
- 当前专利权人： AKZO N.V.
- 当前专利权人地址： Velperweg 76 NL-6824 BM Arnhem NL
- 代理机构： Sieders, René
- 优先权： US68593 19870630; US204044 19880608
- 主分类号： C23C24/08
- IPC分类号： C23C24/08 ; H01B1/22 ; H05K3/10 ; H05K3/20
摘要：
A conductive metal layer is formed on a substrate having a softening point above about 200°C by depositing copper or nickel particles on the substrate, and heating and pressing the metal particles. Unlike similar methods, no developing agent is required to render the metal layer conductive. The coated substrates are useful for a variety of uses such as EMI shielding and printed circuit boards.
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