公开(公告)号：EP4501078A1

公开(公告)日：2025-02-05

申请号：EP23717826.4

申请日：2023-03-29

Applicant: Coloplast A/S

Inventor： SUND, Anders Grove ,  MOLZEN, Lars ,  SLETTEN, Carsten

IPC: H05K1/11 ,  A61N1/04 ,  H05K3/20 ,  A61B5/25 ,  H01B1/22

公开(公告)号：EP4364536B1

公开(公告)日：2025-01-29

申请号：EP21790901.9

申请日：2021-10-13

Inventor： SURARU, Sabin-Lucian ,  KÖLLNBERGER, Andreas

IPC: H05K1/09 ,  H05K3/12 ,  H01B1/20 ,  H01B1/22 ,  H01B1/24

公开(公告)号：EP4484051A1

公开(公告)日：2025-01-01

申请号：EP23756356.4

申请日：2023-02-14

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： NITTA, Norzafriza ,  FUJIWARA, Hidemichi

IPC: B23K35/22 ,  B22F1/00 ,  B22F1/16 ,  B22F1/17 ,  B23K1/00 ,  B23K35/363 ,  H01B1/22

Abstract: A bonding material composition that can improve the shear strength, heat resistance, electrical conductivity, and heat dissipation properties of a bonding layer, a method for manufacturing a bonding material composition, a bonding film, a method for manufacturing a bonded body, and a bonded body are provided.
The bonding material composition according to the invention includes: metal particles (P) including first metal particles (P1) and second metal particles (P2); and a flux, in which the first metal particles (P1) are composed of a core (C1) made of Cu and a Cu 2 O layer covering the core (C1), and the second metal particles (P2) are composed of a core (C2) made of Cu, and Sn or Sn-containing solder covering the core (C2).

公开(公告)号：EP2652059B1

公开(公告)日：2024-12-04

申请号：EP11811183.0

申请日：2011-12-14

Inventor： KNAAPILA, Matti ,  BUCHANAN, Mark ,  HELGESEN, Geir

IPC: C09J9/02 ,  H01B1/22 ,  H01B1/24

公开(公告)号：EP4073008B1

公开(公告)日：2024-11-20

申请号：EP20845247.4

申请日：2020-12-11

Inventor： DHARMADASA, Ruvini ,  DRUFFEL, Thad

IPC: C03C8/18 ,  C09D11/037 ,  C09D11/52 ,  H01B1/22 ,  H01L31/0224 ,  H01L21/48

公开(公告)号：EP4324578B1

公开(公告)日：2024-10-09

申请号：EP22190706.6

申请日：2022-08-17

IPC: B22F1/052 ,  B22F1/068 ,  B22F1/107 ,  B22F7/06 ,  B23K35/02 ,  B23K35/30 ,  H01B1/22 ,  H01L23/00

CPC classification number: B22F1/068 ,  B22F1/052 ,  B22F1/107 ,  B22F7/064 ,  H01L24/29 ,  H01B1/22 ,  B23K35/025 ,  B23K35/3006 ,  H01L2224/838420130101

公开(公告)号：EP4407694A2

公开(公告)日：2024-07-31

申请号：EP24181708.9

申请日：2024-06-12

Applicant: Trina Solar Co., Ltd

Inventor： LIU, Chengfa ,  LV, Dongyun ,  CHEN, Hong

IPC: H01L31/0224 ,  H01B1/22

CPC classification number: H01B1/22 ,  H01L31/022425

Abstract: The present application relates to a conductive paste and a solar cell in which a first electrode (13) is made of said conductive paste and arranged on a side of the emitter (12) away from the semiconductor substrate (1) of the solar cell. The first electrode (13) comprises a body portion (131) and a plurality of connecting portions (132) which extend through part of a passivation layer group (14) and are in contact with the emitter (12. The conductive paste includes a conductive powder, a first glass frit, and a second glass frit. The first glass frit includes at least one of lead-containing glass and bismuth-containing glass. A glass transition temperature of the second glass frit is greater than 600°C. In the conductive paste, a weight percentage of the first glass frit ranges from 0.5% to 5%, and a weight percentage of the second glass frit ranges from 0.5% to 10%.

公开(公告)号：EP3495090B1

公开(公告)日：2024-07-24

申请号：EP17837005.2

申请日：2017-08-02

IPC: B23K35/363 ,  B23K35/36 ,  B23K35/30 ,  H01B1/22 ,  C22C9/02 ,  C22C13/00 ,  C22C13/02 ,  B23K35/26

CPC classification number: B23K35/26 ,  B23K35/30 ,  C22C9/02 ,  C22C13/00 ,  C22C13/02 ,  H01B1/22 ,  B23K35/3615 ,  B23K35/3618

公开(公告)号：EP4036181B1

公开(公告)日：2024-07-17

申请号：EP20867394.7

申请日：2020-09-25

IPC: C09D17/00 ,  H01B1/20 ,  H01B1/22 ,  H01L21/52

CPC classification number: H01B1/22 ,  B23K35/302 ,  B23K35/025 ,  H01L24/03 ,  B23K35/3613

公开(公告)号：EP3127124B1

公开(公告)日：2024-07-10

申请号：EP15773178.7

申请日：2015-02-06

IPC: H01B1/22 ,  C03C3/089 ,  C03C3/066 ,  C03C4/14 ,  C03C8/04 ,  C03C8/16 ,  C03C8/18 ,  C03C17/04 ,  C09D5/24 ,  H01B1/16 ,  H01L31/0224

CPC classification number: H01B1/16 ,  C03C3/066 ,  C03C8/16 ,  C03C17/04 ,  C03C2217/47920130101 ,  C03C2217/4820130101 ,  C03C2217/48520130101 ,  C03C8/04 ,  C03C3/089 ,  C03C4/14 ,  C03C8/18