发明公开
EP0324555A2 Substrate for hybrid IC, hybrid IC using the substrate and its application
失效
SubstratfürHybrid-IC，Hybrid-IC，der dieses Substrat verwendet und dessen Anwendung。
- 专利标题： Substrate for hybrid IC, hybrid IC using the substrate and its application
- 专利标题（中）： SubstratfürHybrid-IC，Hybrid-IC，der dieses Substrat verwendet und dessen Anwendung。
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申请号： EP89300127.1申请日： 1989-01-06
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公开(公告)号： EP0324555A2公开(公告)日： 1989-07-19
- 发明人: Fujii, Mituru , Asai, Tadamichi , Ogawa, Toshio , Ito, Osamu , Ikegami, Akira , Hasegawa, Mitsuru , Kobayashi, Takao , Tamura, Teizo
- 申请人： HITACHI, LTD.
- 申请人地址： 6, Kanda Surugadai 4-chome Chiyoda-ku, Tokyo 100 JP
- 专利权人： HITACHI, LTD.
- 当前专利权人： HITACHI, LTD.
- 当前专利权人地址： 6, Kanda Surugadai 4-chome Chiyoda-ku, Tokyo 100 JP
- 代理机构： Calderbank, Thomas Roger
- 优先权： JP2591/88 19880111
- 主分类号： H01L25/16
- IPC分类号： H01L25/16 ; H01C7/00 ; H01C1/148 ; H01C17/06 ; H01C17/28
摘要：
A substrate for a hybrid IC comprises a substrate (1), a thick film resistor (3) containing glass, formed on the substrate (1), and a thick film conductor (2) at the terminal of the thick film resistor (3). A means for preventing diffusion of the glass from the thick film resistor (3) into the thick film conductor (2) is provided between the thick film resistor (3). This means may be a compound added to the paste used for forming the thick film resistor (3) or may be a paste of metallic powder applied to the terminal of the thick film conductor (2). The thick film conductor (2) has a stable resistance as a thick film microresistor and may be applied to various uses such as cellular radio communication system.
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