发明公开
EP0332834A1 Low dielectric printed circuit boards 失效
Leiterplatten mit niedrigerDielektrizitätskonstante。

Low dielectric printed circuit boards
摘要:
The invention features a printed circuit board and a method of fabricating a printed circuit board with low dielectric materials using a modular technique. Sub-­assemblies (10) are first constructed, tested, and then subsequently incorporated into the final circuit board assembly (20) which has a triplate geometry. Dielectric materials are chosen which enhance the performance of the circuit board.
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