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公开(公告)号：EP0231795A3
公开(公告)日：1988-04-20
申请号：EP87100547
申请日：1987-01-16
发明人： Babu, Surysdevara Vijayakumar , Herrmann, William Frederick , Hoffarth, Joseph Gerard , Markovich, Voya , Wiley, Robert Taylor
CPC分类号： H05K3/08 , H05K3/184 , H05K3/26 , H05K2201/0761 , H05K2203/0783 , H05K2203/095 , H05K2203/1407
摘要： A method of making a printed circuit board is disclosed wherein metallic seed particles (12) are applied to a surface of the substrate (10). An image of the desired conductor pattern is defined by a maskant layer (14) to permit the subsequent electroless deposition of the conductor material (20, 22) upon the exposed seeded areas of the substrate. Then, the substrate surface is subjected to a plasma discharge to facilitate removal of the seed particles (12). Finally, the substrate (10) is washed in a solvent.
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公开(公告)号：EP0373363A2
公开(公告)日：1990-06-20
申请号：EP89120835.7
申请日：1989-11-10
CPC分类号： B29C37/0085 , B29C70/088 , H05K1/0366 , H05K3/445 , H05K3/4641 , H05K2201/09309 , H05K2203/0191 , H05K2203/0278 , H05K2203/068 , H05K2203/143
摘要： Vias in a metallic plane of a desired thickness with a dielectric by providing a layer of dielectric material (5) between two sheets (1, 2) containing clearance holes (3, 4) of the metal of the metallic plane wherein the total thickness of the two sheets corresponds to the desired thickness. Also provided on each sheet is a mask (6, 7) having clearance holes that correspond to the clearance holes in the sheets. On each mask is provided a layer of dielectric (8, 9) and on each layer of dielectric is provided a release layer (10, 11). The composite is laminated to thereby cause dielectric from the layer between the two sheets and the layers adjacent the mask to fill the clearance holes and to bond the metallic planes together. The mask, remaining dielectric adjacent the mask, and release layer are then removed.
摘要翻译： 通过在包含金属平面金属的间隙孔（3,4）的两个片材（1,2）之间提供介电材料层（5），在具有电介质的所需厚度的金属平面中的通孔，其中总厚度 两张纸对应于所需的厚度。 每个片材上还设置有具有对应于片材中的间隙孔的间隙孔的掩模（6,7）。 在每个掩模上设置有电介质层（8,9），并且在每个电介质层上设置有释放层（10,11）。 复合材料层压，从而从两片之间的层和邻近掩模的层引起电介质填充间隙孔并将金属平面粘合在一起。 然后去除掩模，与掩模相邻的剩余电介质和释放层。
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公开(公告)号：EP0231795B1
公开(公告)日：1991-04-24
申请号：EP87100547.6
申请日：1987-01-16
发明人： Babu, Surysdevara Vijayakumar , Herrmann, William Frederick , Hoffarth, Joseph Gerard , Markovich, Voya , Wiley, Robert Taylor
CPC分类号： H05K3/08 , H05K3/184 , H05K3/26 , H05K2201/0761 , H05K2203/0783 , H05K2203/095 , H05K2203/1407
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公开(公告)号：EP0231795A2
公开(公告)日：1987-08-12
申请号：EP87100547.6
申请日：1987-01-16
发明人： Babu, Surysdevara Vijayakumar , Herrmann, William Frederick , Hoffarth, Joseph Gerard , Markovich, Voya , Wiley, Robert Taylor
CPC分类号： H05K3/08 , H05K3/184 , H05K3/26 , H05K2201/0761 , H05K2203/0783 , H05K2203/095 , H05K2203/1407
摘要： A method of making a printed circuit board is disclosed wherein metallic seed particles (12) are applied to a surface of the substrate (10). An image of the desired conductor pattern is defined by a maskant layer (14) to permit the subsequent electroless deposition of the conductor material (20, 22) upon the exposed seeded areas of the substrate. Then, the substrate surface is subjected to a plasma discharge to facilitate removal of the seed particles (12). Finally, the substrate (10) is washed in a solvent.
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公开(公告)号：EP0332834B1
公开(公告)日：1993-06-16
申请号：EP89101910.1
申请日：1989-02-03
IPC分类号： H05K3/46
CPC分类号： H05K1/024 , H05K3/4623 , H05K2201/015 , H05K2201/09536 , H05K2203/061 , Y10T29/49126
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公开(公告)号：EP0373363A3
公开(公告)日：1991-09-11
申请号：EP89120835.7
申请日：1989-11-10
CPC分类号： B29C37/0085 , B29C70/088 , H05K1/0366 , H05K3/445 , H05K3/4641 , H05K2201/09309 , H05K2203/0191 , H05K2203/0278 , H05K2203/068 , H05K2203/143
摘要： Vias in a metallic plane of a desired thickness with a dielectric by providing a layer of dielectric material (5) between two sheets (1, 2) containing clearance holes (3, 4) of the metal of the metallic plane wherein the total thickness of the two sheets corresponds to the desired thickness. Also provided on each sheet is a mask (6, 7) having clearance holes that correspond to the clearance holes in the sheets. On each mask is provided a layer of dielectric (8, 9) and on each layer of dielectric is provided a release layer (10, 11). The composite is laminated to thereby cause dielectric from the layer between the two sheets and the layers adjacent the mask to fill the clearance holes and to bond the metallic planes together. The mask, remaining dielectric adjacent the mask, and release layer are then removed.
摘要翻译： 通过在包含金属平面金属的间隙孔（3,4）的两个片材（1,2）之间提供介电材料层（5），在具有电介质的所需厚度的金属平面中的通孔，其中总厚度 两张纸对应于所需的厚度。 每个片材上还设置有具有对应于片材中的间隙孔的间隙孔的掩模（6,7）。 在每个掩模上设置有电介质层（8,9），并且在每个电介质层上设置有释放层（10,11）。 复合材料层压，从而从两片之间的层和邻近掩模的层引起电介质填充间隙孔并将金属平面粘合在一起。 然后去除掩模，与掩模相邻的剩余电介质和释放层。
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7.发明公开
公开(公告)号：EP0332834A1
公开(公告)日：1989-09-20
申请号：EP89101910.1
申请日：1989-02-03
IPC分类号： H05K3/46
CPC分类号： H05K1/024 , H05K3/4623 , H05K2201/015 , H05K2201/09536 , H05K2203/061 , Y10T29/49126
摘要： The invention features a printed circuit board and a method of fabricating a printed circuit board with low dielectric materials using a modular technique. Sub-assemblies (10) are first constructed, tested, and then subsequently incorporated into the final circuit board assembly (20) which has a triplate geometry. Dielectric materials are chosen which enhance the performance of the circuit board.
摘要翻译： 本发明的特征在于印刷电路板和使用模块化技术制造具有低介电材料的印刷电路板的方法。 子组件（10）首先被构造，测试，然后被并入到具有三板几何形状的最终电路板组件（20）中。 选择提高电路板性能的电介质材料。
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