发明公开
EP0397426A2 IC packaging structure and packaging method
失效
IS-Packungsstruktur und Packungsverfahren。
- 专利标题： IC packaging structure and packaging method
- 专利标题（中）： IS-Packungsstruktur und Packungsverfahren。
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申请号： EP90304901.3申请日： 1990-05-04
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公开(公告)号： EP0397426A2公开(公告)日： 1990-11-14
- 发明人: Ohi, Masayuki
- 申请人： Citizen Watch Co. Ltd.
- 申请人地址： 1-1, 2-chome, Nishi-Shinjuku Shinjuku-ku Tokyo JP
- 专利权人： Citizen Watch Co. Ltd.
- 当前专利权人： Citizen Watch Co. Ltd.
- 当前专利权人地址： 1-1, 2-chome, Nishi-Shinjuku Shinjuku-ku Tokyo JP
- 代理机构： Lawrence, John Gordon
- 优先权： JP115880/89 19890509
- 主分类号： H01L21/60
- IPC分类号： H01L21/60
摘要：
In an IC packaging structure, ball bonding is performed on patterns (4) on a circuit substrate (1) as first bonding, and ballless bonding is performed on pad electrodes (5) on an IC chip (2) as second bonding. An IC packaging method includes a first step of forming a gold ball electrode (5a) on each of pad electrodes (5) of an IC chip, a second step of ball-bonding one end of a gold wire (6) on each of patterns of a circuit substrate, and a third step of thermally compression-bonding the other end of the gold wire on a corresponding one of the gold ball electrodes formed on the pad electrodes.
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