发明公开
EP0416518A2 Process for producing printed circuit boards
失效
Verfahren zur Herstellung von gedruckten Leiterplatten。
- 专利标题： Process for producing printed circuit boards
- 专利标题（中）： Verfahren zur Herstellung von gedruckten Leiterplatten。
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申请号： EP90116931.8申请日： 1990-09-04
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公开(公告)号： EP0416518A2公开(公告)日： 1991-03-13
- 发明人: Nakano, Akikazu
- 申请人： IDEMITSU KOSAN COMPANY LIMITED
- 申请人地址： 1-1, Marunouchi 3-chome Chiyoda-ku Tokyo 100 JP
- 专利权人： IDEMITSU KOSAN COMPANY LIMITED
- 当前专利权人： IDEMITSU KOSAN COMPANY LIMITED
- 当前专利权人地址： 1-1, Marunouchi 3-chome Chiyoda-ku Tokyo 100 JP
- 代理机构： Türk, Dietmar, Dr. rer. nat.
- 优先权： JP229305/89 19890906; JP229306/89 19890906
- 主分类号： H05K1/03
- IPC分类号： H05K1/03
摘要：
A process for producing a printed circuit board is disclosed, in which the following steps are sequentially conducted:
(1) a step for dispersing in at least one of the mediums of water and an organic solvent
(A) 95 to 20% by weight of a styrene polymer having a syndiotactic structure,
(B) 5 to 80% by weight of a fibrous filler having a fiber length of 1 to 50 mm, and
(C) 0.1 to 30 parts by weight of at least one of a binder and a binding fiber in proportion to 100 parts by weight of the total amount of said components (A) and (B), to make a slurry having a concentration of 0.5 to 100 g/l,
(2) a sedimentation step of the dispersed solids in said slurry,
(3) a step for removing at least one of the mediums of water and an organic solvent in the slurry by filtration and drying and molding the residue,
(4) a step for melting with heating and pressure forming the molded product, and
(5) a step for providing a metal layer on the molded article.
The printed circuit board obtained by the process is excellent in impact resistance, heat resistance, mechanical strength and size stability as well as dielectric properties.
(1) a step for dispersing in at least one of the mediums of water and an organic solvent
(A) 95 to 20% by weight of a styrene polymer having a syndiotactic structure,
(B) 5 to 80% by weight of a fibrous filler having a fiber length of 1 to 50 mm, and
(C) 0.1 to 30 parts by weight of at least one of a binder and a binding fiber in proportion to 100 parts by weight of the total amount of said components (A) and (B), to make a slurry having a concentration of 0.5 to 100 g/l,
(2) a sedimentation step of the dispersed solids in said slurry,
(3) a step for removing at least one of the mediums of water and an organic solvent in the slurry by filtration and drying and molding the residue,
(4) a step for melting with heating and pressure forming the molded product, and
(5) a step for providing a metal layer on the molded article.
The printed circuit board obtained by the process is excellent in impact resistance, heat resistance, mechanical strength and size stability as well as dielectric properties.
公开/授权文献
- EP0416518B1 Process for producing printed circuit boards 公开/授权日：1995-12-06
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