HEATED TOBACCO SYSTEM, DEVICE AND CONSUMABLE

    公开(公告)号:EP4454492A1

    公开(公告)日:2024-10-30

    申请号:EP23169787.1

    申请日:2023-04-25

    摘要: A heated tobacco (HT) consumable (100) comprises an electrically conductive track 180, which may be a heating element, arranged between an aerosol-generating substrate (110) and a combining paper (120) that wraps around the aerosol-generating substrate. Electrical contacts 181, 182 of the electrically conductive track are exposed through the combining paper. Each electrical contact may be a contact band around the consumable. A disc (132, 135) may be provided to close one or both ends of the aerosol-generating substrate. The consumable may be configured to be inserted into the cavity of a heated tobacco device (200) in an upstream to downstream direction.

    COPPER/CERAMIC JOINED BODY AND INSULATED CIRCUIT BOARD

    公开(公告)号:EP4447624A1

    公开(公告)日:2024-10-16

    申请号:EP22904155.3

    申请日:2022-12-02

    摘要: This copper/ceramic bonded body (10) includes a copper member (12,13) consisting of copper or a copper alloy and a ceramic member (11), wherein the copper member (12,13) is bonded to the ceramic member (11), an active metal compound layer (21) consisting of an active metal compound is formed on a side of the ceramic member (11) at a bonded interface between the ceramic member (11) and the copper member (12,13), microcracks (25) that extend from the bonded interface toward an inner side of the ceramic member (11) are present in the ceramic member (11), and at least a part of the microcracks (25) are filled with the active metal compound.

    ADHESIVE RESIN COMPOSITION
    8.
    发明公开

    公开(公告)号:EP4406867A1

    公开(公告)日:2024-07-31

    申请号:EP22872726.9

    申请日:2022-09-08

    摘要: An adhesive resin composition according to the present invention is characterized by containing a polyester resin (A) and satisfying: (i) The adhesive resin composition contains substantially no curing agent; and (ii) The adhesive resin composition exhibits an amount of tetrahydrofuran-insoluble matter of 10 mass% or more when having undergone a heating treatment at 200°C for 1 hour. The adhesive resin composition according to the present invention, even with use of substantially no curing agent, has good pot life property, and has excellent solder heat resistance and adhesiveness to various base materials. The present invention also provides a laminate or an adhesive sheet including an adhesive layer made from the adhesive resin composition, a printed-wiring board or a packing material comprising the laminate as a constituent element, and a laminated film for decorating three-dimensional molded article or a film for laminating metal can comprising the adhesive sheet as a constituent element.