A process for preparing a through-hole printed circuit board having at least one through-hole, involves the steps of: (a) applying an acid-soluble cationic electrodeposit photoresist by electrodeposition all over on a surface of a board covered by an electrically conductive metal layer including the through-hole, while setting the board as a cathode; (b) heating the board passed through the step (a) to a tempeature of 50°C to 120°C; (c) exposing the acid-soluble cationic electrodeposit photoresist to light through a photo-mask having a pattern complementary to a pattern of a circuit to be formed, thereby to cure the photoresist, and then developing with a developer to remove only an uncured portion of the photoresist; (d) applying an alkali-soluble anionic electrodeposit etching resist by electrodeposition on a surface of a portion of the electrically conductive metal layer uncoated with the cured photoresist, while setting the board passed through the step (c) as an anode; (e) heating the board passed through the step (d) to a tempeature of 50 to 120°C; (f) removing a coating of the cured acid-soluble cationic electrodeposit photoresist with an aqueous acid solution; (g) etching a portion of the electrically conductive metal layer exposed by the step (f); and (h) removing the remaining alkali-soluble anionic electrodeposit etching resist with an aqueous alkali solution.