A covering tape used for the heat sealing of a plastic carrier tape provided with contiguous pockets for housing electronic component chips, wherein the outer layer comprises a biaxially oriented film made from any of polyester, polypropylene and nylon, while the adhesive layer comprises one or more thermoplastic resins selected from among polyurethane, acrylic, polyvinyl chloride, ethylene-vinyl acetate and polyester resins and, dispersed therein, one or more fine conductive powders selected from among tin oxide, zinc oxide, titanium oxide, carbon black and organosilicon compounds.