发明公开
EP0519631A2 Both-side roughened copper foil with protection film
失效
Beidseitig aufgerauhte Kupferfolie mit Schutzfilm。
- 专利标题： Both-side roughened copper foil with protection film
- 专利标题（中）： Beidseitig aufgerauhte Kupferfolie mit Schutzfilm。
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申请号： EP92305243.5申请日： 1992-06-08
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公开(公告)号： EP0519631A2公开(公告)日： 1992-12-23
- 发明人: Keiji, Azuma, c/o Sumitomo Bakelite , Kimikazu, Katoh, c/o Sumitomo Bakelite , Ryoichi, Oguro, c/o Circuit Foil Japan
- 申请人： SUMITOMO BAKELITE COMPANY LIMITED , CIRCUIT FOIL JAPAN CO. LTD
- 申请人地址： 2-2, Uchisaiwaicho 1-chome Chiyoda-ku Tokyo 100 JP
- 专利权人： SUMITOMO BAKELITE COMPANY LIMITED,CIRCUIT FOIL JAPAN CO. LTD
- 当前专利权人： SUMITOMO BAKELITE COMPANY LIMITED,CIRCUIT FOIL JAPAN CO. LTD
- 当前专利权人地址： 2-2, Uchisaiwaicho 1-chome Chiyoda-ku Tokyo 100 JP
- 代理机构： Simpson, Alison Elizabeth Fraser
- 优先权： JP145704/91 19910618
- 主分类号： H05K3/46
- IPC分类号： H05K3/46 ; H05K3/28 ; H05K3/02
摘要：
Disclosed is a both-side roughened copper foil with a protection film, comprising a metal foil as soft as or softer than copper, or an organic type film having a melting point equal to or higher than a lamination temperature, laminated on one side of a copper foil with both sides roughened, the metal foil or organic film being continuously or continually bonded or adhered to the copper foil. It is possible to protect the ruggedness on the roughened surface at the time the both-side roughened copper foil is cut, packed, transported or stacked on another both-side roughened copper foil, simplify the press molding work, and improve the production efficiency particularly in the step of fabricating a copper-clad laminated board for a printed circuit board as well as the quality of the acquired copper-clad laminated board.
公开/授权文献
- EP0519631B1 Both-side roughened copper foil with protection film 公开/授权日：1998-04-15
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