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公开(公告)号：EP0519631B1
公开(公告)日：1998-04-15
申请号：EP92305243.5
申请日：1992-06-08
发明人： Keiji, Azuma, c/o Sumitomo Bakelite , Kimikazu, Katoh, c/o Sumitomo Bakelite , Ryoichi, Oguro, c/o Circuit Foil Japan
CPC分类号： H05K3/022 , H05K3/025 , H05K3/382 , H05K3/4611 , H05K2201/0355
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公开(公告)号：EP0519631A3
公开(公告)日：1994-12-28
申请号：EP92305243.5
申请日：1992-06-08
发明人： Keiji, Azuma, c/o Sumitomo Bakelite , Kimikazu, Katoh, c/o Sumitomo Bakelite , Ryoichi, Oguro, c/o Circuit Foil Japan
CPC分类号： H05K3/022 , H05K3/025 , H05K3/382 , H05K3/4611 , H05K2201/0355
摘要： Disclosed is a both-side roughened copper foil with a protection film, comprising a metal foil as soft as or softer than copper, or an organic type film having a melting point equal to or higher than a lamination temperature, laminated on one side of a copper foil with both sides roughened, the metal foil or organic film being continuously or continually bonded or adhered to the copper foil. It is possible to protect the ruggedness on the roughened surface at the time the both-side roughened copper foil is cut, packed, transported or stacked on another both-side roughened copper foil, simplify the press molding work, and improve the production efficiency particularly in the step of fabricating a copper-clad laminated board for a printed circuit board as well as the quality of the acquired copper-clad laminated board.
摘要翻译： 本发明公开了一种具有保护膜的双面粗化铜箔，其包含比铜软或软的金属箔或者具有等于或高于层压温度的熔点的有机类膜， 两面粗糙的铜箔，金属箔或有机膜连续或连续地粘合或粘附到铜箔上。 在双面粗化铜箔被切断，包装，运送或堆叠在另一个双面粗化铜箔上时，可以保护粗糙表面上的粗糙度，简化压制成型工作并提高生产效率。 在制造用于印刷电路板的覆铜层压板的步骤以及所获得的覆铜层压板的质量方面。
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3.发明公开Both-side roughened copper foil with protection film 失效Beidseitig aufgerauhte Kupferfolie mit Schutzfilm。
公开(公告)号：EP0519631A2
公开(公告)日：1992-12-23
申请号：EP92305243.5
申请日：1992-06-08
发明人： Keiji, Azuma, c/o Sumitomo Bakelite , Kimikazu, Katoh, c/o Sumitomo Bakelite , Ryoichi, Oguro, c/o Circuit Foil Japan
CPC分类号： H05K3/022 , H05K3/025 , H05K3/382 , H05K3/4611 , H05K2201/0355
摘要： Disclosed is a both-side roughened copper foil with a protection film, comprising a metal foil as soft as or softer than copper, or an organic type film having a melting point equal to or higher than a lamination temperature, laminated on one side of a copper foil with both sides roughened, the metal foil or organic film being continuously or continually bonded or adhered to the copper foil. It is possible to protect the ruggedness on the roughened surface at the time the both-side roughened copper foil is cut, packed, transported or stacked on another both-side roughened copper foil, simplify the press molding work, and improve the production efficiency particularly in the step of fabricating a copper-clad laminated board for a printed circuit board as well as the quality of the acquired copper-clad laminated board.
摘要翻译： 公开了一种具有保护膜的双面粗糙化铜箔，其包含比铜柔软或比软的金属箔，或层压在层压温度的一侧上的熔点等于或高于层压温度的有机型膜 铜箔两侧粗糙，金属箔或有机膜连续或连续地粘合或粘附在铜箔上。 在双面粗糙的铜箔被切割，包装，运输或堆叠在另一个双面粗糙的铜箔上时，可以保护粗糙表面上的粗糙度，简化压模成型工作，特别是提高生产效率 在制造用于印刷电路板的覆铜层压板以及所获得的覆铜层压板的质量的步骤中。
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