发明公开
EP0521738A2 Bath and method for the electroless plating of tin and tin-lead alloy
失效
Bad und Verfahren zur stromlosen Beschichtung mit Zinn oder Zinn-Blei-Legierung。
- 专利标题： Bath and method for the electroless plating of tin and tin-lead alloy
- 专利标题（中）： Bad und Verfahren zur stromlosen Beschichtung mit Zinn oder Zinn-Blei-Legierung。
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申请号： EP92306195.6申请日： 1992-07-06
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公开(公告)号： EP0521738A2公开(公告)日： 1993-01-07
- 发明人: Uchida, Hiroki, c/o Chuo Kenkyujyo , Kubo, Motonobu, c/o Chuo Kenkyujyo , Kiso, Masayuki, c/o Chuo Kenkyujyo , Hotta, Teruyuki, c/o Chuo Kenkyujyo , Kamitamari, Tohru, c/o Chuo Kenkyujyo
- 申请人： C. UYEMURA & CO, LTD
- 申请人地址： 2-6 Dosho-machi 3-chome Chuo-ku Osaka-shi Osaka JP
- 专利权人： C. UYEMURA & CO, LTD
- 当前专利权人： C. UYEMURA & CO, LTD
- 当前专利权人地址： 2-6 Dosho-machi 3-chome Chuo-ku Osaka-shi Osaka JP
- 代理机构： Linn, Samuel Jonathan
- 优先权： JP190768/91 19910704; JP224944/91 19910809
- 主分类号： C23C18/52
- IPC分类号： C23C18/52 ; C23C18/48
摘要：
A tin or tin-lead alloy electroless plating bath comprising (A) a stannous salt or a mixture of a stannous salt and a lead salt, (B) an acid, (C) thiourea or a thiourea derivative, and (D) a reducing agent is improved by adding (E) a nonionic surfactant and optionally, (F) a cationic surfactant, a nitrogenous heterocyclic compound or a derivative thereof, or alternatively by adding (G) an ammonium or quaternary ammonium ion. From the bath, uniform films of fine grains will chemically deposit on fine pitch printed wiring boards intended for SMT.
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