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    Metal ion replenishment to plating bath
    1.
    发明公开
    Metal ion replenishment to plating bath 失效
    维尔法赫恩·奥姆弗里森（Elfrischen），伊朗（Metallbeschichtungsbades）。

    公开(公告)号：EP0524748A1

    公开(公告)日：1993-01-27

    申请号：EP92306302.8

    申请日：1992-07-09

    申请人： C. UYEMURA & CO, LTD

    发明人： Uchida, Hiroki, c/o Chuo Kenkyujyo ,  Kubo, Motonobu, c/o Chuo Kenkyujyo ,  Kiso, Masayuki, c/o Chuo Kenkyujyo ,  Hotta, Teruyuki, c/o Chuo Kenkyujyo ,  Kamitamari, Tohru, c/o Chuo Kenkyujyo

    IPC分类号： C25D21/14 ,  C23C18/16

    CPC分类号： C25D21/14 ,  C23C18/1617

    摘要： For replenishing a metal ion to a plating bath, a soluble electrode of the same type of metal as in the bath and a counter electrode of a metal material having a nobler standard electrode potential than the soluble electrode are immersed in the bath. Electricity is conducted between the soluble electrode and the counter electrode, thereby dissolving the soluble electrode to replenish an ion of the metal of the soluble electrode to the bath. The potential of the counter electrode is measured using a reference electrode of the same metal as the soluble electrode. The quantity of electricity is controlled such that the measured potential may not be negative with respect to the reference electrode, thereby preventing deposition of the dissolving metal ion on the counter electrode while ensuring a high rate of metal ion dissolution.

    摘要翻译： 为了将金属离子补充到电镀槽中，将与电解槽相同类型的金属的可溶电极和具有比可溶性电极高的标准电极电位的金属材料的对电极浸入浴中。 在可溶性电极和对电极之间进行电流，从而溶解可溶性电极以将可溶性电极的金属的离子补充到浴中。 使用与可溶性电极相同的金属的参比电极测量对电极的电位。 控制电量使得测量的电位相对于参考电极可能不是负的，从而防止溶解金属离子沉积在对电极上，同时确保高的金属离子溶解速率。