A method for slicing a cylindrical semiconductor ingot (34) into thin wafer pieces using an inner peripheral slicing blade (14) is provided. In the wafer slicing method, a grind stone shaft (62) with a grind stone (16) mounted to the tip end thereof is located movably axially within a rotor (38) provided with the inner peripheral slicing blade (14) and the grind stone shaft (62) and rotor (38) can be rotated integrally. The grind stone (16) and slicing blade (14) are arranged efficiently, so that, after the semiconductor ingot (34) is sliced with the slicing blade (14), the grind stone approaches the end face of the ingot (349 to grind it. This can save a lapping step, thereby improving a working efficiency.