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公开(公告)号：EP0534499A3
公开(公告)日：1993-04-21
申请号：EP92119722.4
申请日：1988-01-29
发明人： Honda, Katsuo , Sawafuji, Susumu
摘要： A method for slicing a cylindrical semiconductor ingot (34) into thin wafer pieces using an inner peripheral slicing blade (14) is provided. In the wafer slicing method, a grind stone shaft (62) with a grind stone (16) mounted to the tip end thereof is located movably axially within a rotor (38) provided with the inner peripheral slicing blade (14) and the grind stone shaft (62) and rotor (38) can be rotated integrally. The grind stone (16) and slicing blade (14) are arranged efficiently, so that, after the semiconductor ingot (34) is sliced with the slicing blade (14), the grind stone approaches the end face of the ingot (349 to grind it. This can save a lapping step, thereby improving a working efficiency.
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公开(公告)号：EP0343279B1
公开(公告)日：1992-09-30
申请号：EP88110544.9
申请日：1988-07-01
发明人： Honda, Katsuo , Sawafuji, Susumu , Tomita, Tomio
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公开(公告)号：EP0750972B1
公开(公告)日：2001-09-26
申请号：EP96304738.6
申请日：1996-06-27
发明人： Sawafuji, Susumu , Takai, Nozomi
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公开(公告)号：EP0534499A2
公开(公告)日：1993-03-31
申请号：EP92119722.4
申请日：1988-01-29
发明人： Honda, Katsuo , Sawafuji, Susumu
摘要： A method for slicing a cylindrical semiconductor ingot (34) into thin wafer pieces using an inner peripheral slicing blade (14) is provided. In the wafer slicing method, a grind stone shaft (62) with a grind stone (16) mounted to the tip end thereof is located movably axially within a rotor (38) provided with the inner peripheral slicing blade (14) and the grind stone shaft (62) and rotor (38) can be rotated integrally. The grind stone (16) and slicing blade (14) are arranged efficiently, so that, after the semiconductor ingot (34) is sliced with the slicing blade (14), the grind stone approaches the end face of the ingot (349 to grind it. This can save a lapping step, thereby improving a working efficiency.
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公开(公告)号：EP0750972A1
公开(公告)日：1997-01-02
申请号：EP96304738.6
申请日：1996-06-27
发明人： Sawafuji, Susumu , Takai, Nozomi
摘要： In an inner diameter saw slicing machine with built-in grinder, the rotational center of a grinding wheel (28) is displaced in the slice feed direction with regard to the rotational center of an inner diameter saw (14). As a result, the diameter of the grinding wheel (28) can be smaller, and the slice movement distance of the ingot (W) can be shorter. Therefore, it is possible to provide a lower priced slicing machine with built-in grinder wherein the slicing time is shorter and the grinding face is accurate.
摘要翻译： 在内径锯切割机具有内置研磨机，研磨轮的转动中心（28）在所述切片进给方向相对于内径锯（14）的旋转中心位移。 其结果是，砂轮（28）的直径可以更小，并且所述锭（W）的片移动距离可以更短。 因此，可以提供价格较低的切片机内置有粉碎机worin切片时间短，抛光面是否准确。
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6.发明公开Internal peripheral edge type blade holding device 失效Vorrichtung zum Halten eines Blattes mit interner施奈德。
公开(公告)号：EP0343279A1
公开(公告)日：1989-11-29
申请号：EP88110544.9
申请日：1988-07-01
发明人： Honda, Katsuo , Sawafuji, Susumu , Tomita, Tomio
摘要： In the blade holding device a head assembly (14) for stretching and holding an internal peripheral edge blade (32) is supported to a rotary plate (12) through 4 plate springs (16) spaced at 90° intervals. Accordingly, when stretching the internal peripheral edge blade (32), even if the tension assembly (14) is deformed because of the anisotropic property of the blade (32), such deformation can be absorbed by the plate springs (16) and thus is not transmitted to the rotary plate (12), so that the swaying of the edge of the internal peripheral edge blade (32) can be prevented in cutting the ingot.
摘要翻译： 在刀片保持装置中，用于拉伸和保持内周缘刀片（32）的头部组件（14）通过间隔90°间隔的4个板簧（16）支撑在旋转板（12）上。 因此，在拉伸内周刃（32）时，即使张力组件（14）由于叶片（32）的各向异性而变形，这种变形也可被板簧（16）吸收，因此是 不传递到旋转板（12），从而在切割锭时可以防止内周缘刀片（32）的边缘的摆动。
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