发明公开
EP0610967A2 Slicing machine
失效
Masferine zum Zerschneiden von Einkristallbarren在Wafern mittels einerInnenlochsäge。
- 专利标题: Slicing machine
- 专利标题(中): Masferine zum Zerschneiden von Einkristallbarren在Wafern mittels einerInnenlochsäge。
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申请号: EP94106144.2申请日: 1991-05-08
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公开(公告)号: EP0610967A2公开(公告)日: 1994-08-17
- 发明人: Katayama, Ichiro , Kamoshita, Yoshio
- 申请人: TOKYO SEIMITSU CO.,LTD.
- 申请人地址: 7-1, Shimorenjaku 9-chome Mitaka-shi Tokyo JP
- 专利权人: TOKYO SEIMITSU CO.,LTD.
- 当前专利权人: TOKYO SEIMITSU CO.,LTD.
- 当前专利权人地址: 7-1, Shimorenjaku 9-chome Mitaka-shi Tokyo JP
- 代理机构: Hering, Hartmut, Dipl.-Ing.
- 优先权: JP120370/90 19900510; JP60329/91 19910325
- 主分类号: B28D5/02
- IPC分类号: B28D5/02 ; B23D59/00
摘要:
A slicing machine is disclosed in which a crystal ingot is sliced by a rotary blade (14) while the inner peripheral cutting edge (16) of the blade (14) is kept in a highly rigid state. In particular, in a slicing machine which is adapted to slice out a crystal ingot (20) into thin pieces by use of an inner peripheral cutting edge (16) of a doughnut-shaped rotary blade (14), an axial force is previously applied to the rotary blade (14) prior to starting of the slicing to thereby displace the rotary blade (14) in the axial direction thereof and thus, while the rigidity of the inner peripheral cutting edge (16) is kept in a high state, the crystal ingot (20) is sliced so as to realize a highly accurate slicing operation.
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