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    A slicing machine and a slicing method by the same
    1.
    发明公开
    A slicing machine and a slicing method by the same 失效
    Schneidemachine und Abschneideverfahren mit dieser Maschine。

    公开(公告)号：EP0456223A1

    公开(公告)日：1991-11-13

    申请号：EP91107503.4

    申请日：1991-05-08

    申请人： TOKYO SEIMITSU CO.,LTD.

    发明人： Katayama, Ichiro ,  Kamoshita, Yoshio

    IPC分类号： B23D5/02 ,  B23D45/08 ,  B26D1/147 ,  H01L21/304

    CPC分类号： B28D5/028 ,  B23D47/005 ,  B23D59/002 ,  Y10S125/901 ,  Y10T83/148

    摘要： A slicing method is disclosed in which a crystal ingot is sliced by a rotary blade (14) while the inner peripheral cutting edge of the blade (14) is kept in a highly rigid state. In particular, in a slicing machine which is adapted to slice out a crystal ingot (20) into thin pieces by use of an inner peripheral cutting edge 16 of a doughnut-shaped rotary blade (14), an axial force is previously applied to the rotary blade (14) prior to starting of the slicing to thereby displace the rotary blade 14 in the axial direction thereof and thus, while the rigidity of the inner peripheral cutting edge (16) is kept in a high state, the crystal ingot (20) is sliced so as to realize a highly accurate slicing operation.

    摘要翻译： 公开了一种切片方法，其中，当刀片（14）的内周切削刃保持在高度刚性状态时，通过旋转刀片（14）切割晶锭。 特别地，在适于通过使用环形旋转刀片（14）的内周切削刃16将晶锭（20）切割成薄片的切片机中，预先将轴向力施加到 旋转刀片（14）在开始切片之前使旋转刀片14沿其轴向移位，因此在内周切削刃（16）的刚性保持在高状态的同时，晶锭（20 ）切片，以实现高精度的切片操作。

    Slicing machine
    3.
    发明公开
    Slicing machine 失效
    Masferine zum Zerschneiden von Einkristallbarren在Wafern mittels einerInnenlochsäge。

    公开(公告)号：EP0610967A2

    公开(公告)日：1994-08-17

    申请号：EP94106144.2

    申请日：1991-05-08

    申请人： TOKYO SEIMITSU CO.,LTD.

    发明人： Katayama, Ichiro ,  Kamoshita, Yoshio

    IPC分类号： B28D5/02 ,  B23D59/00

    CPC分类号： B28D5/028 ,  B23D47/005 ,  B23D59/002 ,  Y10S125/901 ,  Y10T83/148

    摘要： A slicing machine is disclosed in which a crystal ingot is sliced by a rotary blade (14) while the inner peripheral cutting edge (16) of the blade (14) is kept in a highly rigid state. In particular, in a slicing machine which is adapted to slice out a crystal ingot (20) into thin pieces by use of an inner peripheral cutting edge (16) of a doughnut-shaped rotary blade (14), an axial force is previously applied to the rotary blade (14) prior to starting of the slicing to thereby displace the rotary blade (14) in the axial direction thereof and thus, while the rigidity of the inner peripheral cutting edge (16) is kept in a high state, the crystal ingot (20) is sliced so as to realize a highly accurate slicing operation.

    摘要翻译： 公开了一种切割机，其中，当刀片（14）的内周切削刃（16）保持在高度刚性状态时，通过旋转刀片（14）切割晶锭。 特别地，在适于通过使用环形旋转刀片（14）的内周切削刃（16）将晶锭（20）切割成薄片的切片机中，预先施加轴向力 在开始切片之前转动到旋转刀片（14），从而使旋转刀片（14）在其轴向方向上移位，因此当内周切削刃（16）的刚性保持在高状态时， 将晶锭（20）切片，以实现高精度的切片操作。

    Slicing machine
    4.
    发明公开
    Slicing machine 失效
    Masferine zum Zerschneiden von Einkristallbarren在Wafern mittels einerInnenlochsäge。

    公开(公告)号：EP0610967A3

    公开(公告)日：1995-08-02

    申请号：EP94106144.2

    申请日：1991-05-08

    申请人： TOKYO SEIMITSU CO.,LTD.

    发明人： Katayama, Ichiro ,  Kamoshita, Yoshio

    IPC分类号： B28D5/02 ,  B23D59/00

    CPC分类号： B28D5/028 ,  B23D47/005 ,  B23D59/002 ,  Y10S125/901 ,  Y10T83/148

    摘要： A slicing machine is disclosed in which a crystal ingot is sliced by a rotary blade (14) while the inner peripheral cutting edge (16) of the blade (14) is kept in a highly rigid state. In particular, in a slicing machine which is adapted to slice out a crystal ingot (20) into thin pieces by use of an inner peripheral cutting edge (16) of a doughnut-shaped rotary blade (14), an axial force is previously applied to the rotary blade (14) prior to starting of the slicing to thereby displace the rotary blade (14) in the axial direction thereof and thus, while the rigidity of the inner peripheral cutting edge (16) is kept in a high state, the crystal ingot (20) is sliced so as to realize a highly accurate slicing operation.

    摘要翻译： 公开了一种切片方法，其中，当刀片（14）的内周切削刃保持在高度刚性状态时，通过旋转刀片（14）切割晶锭。 特别地，在适于通过使用环形旋转刀片（14）的内周切削刃16将晶锭（20）切割成薄片的切片机中，预先将轴向力施加到 旋转刀片（14）在开始切片之前使旋转刀片14沿其轴向移位，因此在内周切削刃（16）的刚性保持在高状态的同时，晶锭（20 ）切片，以实现高精度的切片操作。

    Method of chamfering semiconductor wafer
    5.
    发明公开
    Method of chamfering semiconductor wafer 失效
    Verfahren zum Abkanten einer Halbleiterscheibe。

    公开(公告)号：EP0544256A1

    公开(公告)日：1993-06-02

    申请号：EP92120089.5

    申请日：1992-11-25

    申请人： TOKYO SEIMITSU CO.,LTD.

    发明人： Honda, Katsuo ,  Kamoshita, Yoshio ,  Shibaoka, Shinji ,  Tago, Katsuhiro

    IPC分类号： B24B9/06 ,  H01L21/304

    CPC分类号： H01L21/02021 ,  B24B9/065

    摘要： According to the present invention, the rotary axis 0 - 0 of a grindstone (22) is inclined to the rotary axis P - P of a semiconductor wafer (20) through an angle ϑ in a direction of the tangent line of the semiconductor wafer. Accordingly, a moving direction of abrasive grains of the grindstone (22) is divided into two including a component force A₁ in the grinding direction and a component force A₂ in the perpendicular direction, and these component forces increase the number of acting abrasive grains, so that the accuracy of the chamfering shape and the surface roughness can be improved. According to the present invention, the peripheral edge of the rotating semiconductor wafer is chamfered while the rotating grindstone (24) is reciprocatingly moved along the inclined grinding surface (25), whereby the number of the acting abrasive grains are increased, so that the accuracy of the chamfering shape and the surface roughness can be improved.

    摘要翻译： 根据本发明，砂轮（22）的旋转轴线0-0相对于半导体晶片（20）的旋转轴线P-P在半导体晶片的切线方向上以角度θ倾斜。 因此，磨石（22）的磨粒的移动方向分为磨削方向上的分力A1和垂直方向的分力A2，这些分力增加作用磨粒的数量，因此 可以提高倒角形状的精度和表面粗糙度。 根据本发明，旋转的半导体晶片的周边边缘被倒角，同时旋转的磨石（24）沿着倾斜研磨表面（25）往复移动，由此增加作用磨料颗粒的数量，使得精度 可以提高倒角形状和表面粗糙度。