发明公开
- 专利标题: A new compound with room temperature electrical resistivity comparable to that of elemental copper
- 专利标题(中): 室温电阻率与元素铜相当的新化合物
-
申请号: EP94101171.0申请日: 1994-01-27
-
公开(公告)号: EP0612855A2公开(公告)日: 1994-08-31
- 发明人: Aboelfotoh, Mohamed Osama , Brady, Michael John , Krusin-Elbaum, Lia
- 申请人: International Business Machines Corporation
- 申请人地址: Old Orchard Road Armonk, N.Y. 10504 US
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: Old Orchard Road Armonk, N.Y. 10504 US
- 代理机构: Schäfer, Wolfgang, Dipl.-Ing.
- 优先权: US21146 19930223
- 主分类号: C22C9/00
- IPC分类号: C22C9/00 ; H01L23/532
摘要:
The present invention relates to novel compounds that exhibit unusually low electrical resistivity at room temperature. More specifically, it has been discovered that the incorporation of at least 1 to 15 atomic percent of gallium and/or at least 1 to 15 atomic percent gold into stoichiometric copper germanide (Cu₃Ge) compound results in a room temperature resistivity comparable to elemental copper, but with superior chemical and electronic stability upon exposure to air or oxygen at high temperatures. Furthermore, the compounds of the present invention have none of the problems associated with the diffusion of copper into elemental and compound semiconductors which oftentimes lead to the degradation of the semiconductor device characteristics. Additionally, the present invention relates to a method of preparing the novel compounds mentioned previously hereinabove.
公开/授权文献
信息查询