发明公开
EP0630173A2 Process for preparing printed circuit board
失效
Verfahren zur Herstellung einer Leiterplatte。
- 专利标题: Process for preparing printed circuit board
- 专利标题(中): Verfahren zur Herstellung einer Leiterplatte。
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申请号: EP94303930.5申请日: 1994-06-01
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公开(公告)号: EP0630173A2公开(公告)日: 1994-12-21
- 发明人: Ohta, Fumihiko , Nojiri, Takeshi , Tsuchikawa, Shinji , Nakano, Akio , Ishimaru, Toshiaki , Yamazaki, Hiroshi , Akaboshi, Haruo , Kawamoto, Mineo , Takahashi, Akio
- 申请人: Hitachi Chemical Co., Ltd. , HITACHI, LTD.
- 申请人地址: 1-1, Nishishinjuku 2-chome Shinjuku-ku, Tokyo 160 JP
- 专利权人: Hitachi Chemical Co., Ltd.,HITACHI, LTD.
- 当前专利权人: Hitachi Chemical Co., Ltd.,HITACHI, LTD.
- 当前专利权人地址: 1-1, Nishishinjuku 2-chome Shinjuku-ku, Tokyo 160 JP
- 代理机构: Wood, Anthony Charles
- 优先权: JP132261/93 19930603; JP306958/93 19931208
- 主分类号: H05K3/18
- IPC分类号: H05K3/18 ; G03F7/033 ; C23C18/16
摘要:
Disclosed is a process for preparing a printed circuit board, which comprises the steps of:
(1) forming, on the surface of an insulating substrate on a necessitate portion of which electrolessly plated copper is to be precipitated, a layer of a light-sensitive resin composition comprising (a) 40 to 80 parts by weight of a vinyl-polymerized high molecular weight binder having an acid value of 10 to 46 mgKOH/g, (b) 20 to 60 parts by weight of a compound having at least two polymerizable unsaturated double bonds in a molecule, with the total amount of Components (a) and (b) being 100 parts by weight, and (c) a photopolymerization initiator generating free radicals by irradiation of active light in an amount of 0.1 to 10 parts by weight based on 100 parts by weight of Components (a) and (b);
(2) forming a negative pattern of the light-sensitive resin composition on the surface of the substrate by irradiating active light imagewisely and developing with a semi-aqueous developing solution; and
(3) forming a circuit pattern by electroless copper plating by using the negative pattern of the light-sensitive resin composition on the surface of the substrate as a plating resist.
(1) forming, on the surface of an insulating substrate on a necessitate portion of which electrolessly plated copper is to be precipitated, a layer of a light-sensitive resin composition comprising (a) 40 to 80 parts by weight of a vinyl-polymerized high molecular weight binder having an acid value of 10 to 46 mgKOH/g, (b) 20 to 60 parts by weight of a compound having at least two polymerizable unsaturated double bonds in a molecule, with the total amount of Components (a) and (b) being 100 parts by weight, and (c) a photopolymerization initiator generating free radicals by irradiation of active light in an amount of 0.1 to 10 parts by weight based on 100 parts by weight of Components (a) and (b);
(2) forming a negative pattern of the light-sensitive resin composition on the surface of the substrate by irradiating active light imagewisely and developing with a semi-aqueous developing solution; and
(3) forming a circuit pattern by electroless copper plating by using the negative pattern of the light-sensitive resin composition on the surface of the substrate as a plating resist.
公开/授权文献
- EP0630173B1 Process for preparing printed circuit board 公开/授权日:2002-08-14
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