Process for preparing printed circuit board
    1.
    发明公开
    Process for preparing printed circuit board 失效
    Verfahren zur Herstellung einer Leiterplatte。

    公开(公告)号:EP0630173A2

    公开(公告)日:1994-12-21

    申请号:EP94303930.5

    申请日:1994-06-01

    IPC分类号: H05K3/18 G03F7/033 C23C18/16

    摘要: Disclosed is a process for preparing a printed circuit board, which comprises the steps of:

    (1) forming, on the surface of an insulating substrate on a necessitate portion of which electrolessly plated copper is to be precipitated, a layer of a light-sensitive resin composition comprising (a) 40 to 80 parts by weight of a vinyl-polymerized high molecular weight binder having an acid value of 10 to 46 mgKOH/g, (b) 20 to 60 parts by weight of a compound having at least two polymerizable unsaturated double bonds in a molecule, with the total amount of Components (a) and (b) being 100 parts by weight, and (c) a photopolymerization initiator generating free radicals by irradiation of active light in an amount of 0.1 to 10 parts by weight based on 100 parts by weight of Components (a) and (b);
    (2) forming a negative pattern of the light-sensitive resin composition on the surface of the substrate by irradiating active light imagewisely and developing with a semi-aqueous developing solution; and
    (3) forming a circuit pattern by electroless copper plating by using the negative pattern of the light-sensitive resin composition on the surface of the substrate as a plating resist.

    摘要翻译: 公开了一种制备印刷电路板的方法,包括以下步骤:(1)在要沉积无电镀铜的必需部分上的绝缘基板的表面上形成光敏层 树脂组合物,其包含(a)40至80重量份的酸值为10至46mgKOH / g的乙烯基聚合的高分子量粘合剂,(b)20至60重量份具有至少两个可聚合的 不饱和双键,组分(a)和(b)的总量为100重量份,和(c)光聚合引发剂通过以0.1〜10重量份的量照射活性光而产生自由基 基于100重量份的组分(a)和(b)的重量; (2)通过成像地照射活性光并用半显影液显影来在感光树脂组合物的表面上形成负图案; 和(3)通过使用感光性树脂组合物的负图案作为电镀抗蚀剂在基板的表面上通过化学镀铜形成电路图案。

    Process for preparing printed circuit board
    3.
    发明公开
    Process for preparing printed circuit board 失效
    制备印刷电路板的过程

    公开(公告)号:EP0630173A3

    公开(公告)日:1996-07-03

    申请号:EP94303930.5

    申请日:1994-06-01

    IPC分类号: H05K3/18 G03F7/033 C23C18/16

    摘要: Disclosed is a process for preparing a printed circuit board, which comprises the steps of:
    (1) forming, on the surface of an insulating substrate on a necessitate portion of which electrolessly plated copper is to be precipitated, a layer of a light-sensitive resin composition comprising (a) 40 to 80 parts by weight of a vinyl-polymerized high molecular weight binder having an acid value of 10 to 46 mgKOH/g, (b) 20 to 60 parts by weight of a compound having at least two polymerizable unsaturated double bonds in a molecule, with the total amount of Components (a) and (b) being 100 parts by weight, and (c) a photopolymerization initiator generating free radicals by irradiation of active light in an amount of 0.1 to 10 parts by weight based on 100 parts by weight of Components (a) and (b); (2) forming a negative pattern of the light-sensitive resin composition on the surface of the substrate by irradiating active light imagewisely and developing with a semi-aqueous developing solution; and (3) forming a circuit pattern by electroless copper plating by using the negative pattern of the light-sensitive resin composition on the surface of the substrate as a plating resist.

    摘要翻译: 本发明公开了一种制备印刷电路板的方法,该方法包括以下步骤:(1)在需要沉积无电镀铜的必需部分的绝缘基板的表面上形成光敏层 (a)40-80重量份的酸值为10-46mgKOH / g的乙烯基聚合的高分子量粘合剂,(b)20-60重量份的具有至少两个可聚合的化合物的树脂组合物 (a)和(b)的总量为100重量份的分子内具有不饱和双键的光聚合引发剂,和(c)通过活性光照射产生自由基的光聚合引发剂,其量为0.1-10份 基于100重量份的组分(a)和(b)的重量; (2)通过图像照射活性光线并用半水显影液显影,在基材表面上形成光敏树脂组合物的负图案; 和(3)通过在衬底的表面上使用光敏树脂组合物的负图案作为电镀抗蚀剂,通过无电镀铜形成电路图案。