发明公开
- 专利标题: Semiconductor laser device and method of fabricating the laser device
- 专利标题(中): 半导体激光装置及其制造方法。
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申请号: EP94111892.9申请日: 1994-07-29
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公开(公告)号: EP0637862A2公开(公告)日: 1995-02-08
- 发明人: Goto, Jun , Migita, Masahito , Taike, Akira, No. 7, Hitachi , Momose, Masayuki , Nakatsuka, Shin'ichi
- 申请人: HITACHI, LTD.
- 申请人地址: 6, Kanda Surugadai 4-chome Chiyoda-ku, Tokyo 101 JP
- 专利权人: HITACHI, LTD.
- 当前专利权人: HITACHI, LTD.
- 当前专利权人地址: 6, Kanda Surugadai 4-chome Chiyoda-ku, Tokyo 101 JP
- 代理机构: Strehl Schübel-Hopf Groening & Partner
- 优先权: JP194471/93 19930805; JP62384/94 19940331
- 主分类号: H01S3/19
- IPC分类号: H01S3/19 ; H01L33/00 ; H01L21/20 ; H01L21/36
摘要:
In a buried type semiconductor laser device composed of a II-VI compound semiconductor, a buried layer 9 - 11 is made of a II-VI compound semiconductor having a refraction factor lower than that of an active layer of the laser device. The buried layer has a forbidden band width larger than that of an active layer of the laser device. The buried layer has such a composition that the lattice constant thereof is substantially matched to that of a substrate on which the laser device is grown. The buried layer has an electric resistance high enough not to exert an effect on the operation of the laser composed of an n-type clad-active layer-a p-type clad.
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