A method for manufacturing printed circuit board by forming wiring pattern by chemical metal plating using a negative pattern made of a photosensitive resin composition layer as the plating resist, wherein the photosensitive resin comprises at least a linear high polymer composed of repeating units expressed by the following general formula (1) ;
where, R 1 is any of H, an alkyl group having 1-9 carbon atoms, an alkoxy group having 1-9 carbon atoms, and a carboxyalkyl group having 1-9 carbon atoms, R 2 is an alkyl group having 0-9 carbon atoms, and n is the polymerized number of the repeating unit, and an organic compound expressed by the following general formula (2) ;
where, R 3 is either of H or an alkyl group having 1-6 carbon atoms, X is either of NH or S, and Z is either of N or C-Y, where Y is any of H, NH 2 , or SH.