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    A method for manufacturing printed circuit board
    1.
    发明公开
    A method for manufacturing printed circuit board 失效
    Verfahren zur Herstellung einer Leiterplatte。

    公开(公告)号：EP0669793A2

    公开(公告)日：1995-08-30

    申请号：EP95301193.9

    申请日：1995-02-23

    申请人： HITACHI, LTD. ,  HITACHI CHEMICAL CO., LTD.

    发明人： Satsu, Yuichi ,  Akahoshi, Haruo ,  Kawamoto, Mineo ,  Takahashi, Akio ,  Miyazaki, Masashi ,  Ishimaru, Toshiaki

    IPC分类号： H05K3/10 ,  G03F7/085

    CPC分类号： G03F7/085 ,  H05K3/0076 ,  H05K3/062 ,  H05K3/108 ,  H05K3/384 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2203/1105 ,  H05K2203/124 ,  Y10S430/155

    摘要： A method for manufacturing printed circuit board by forming wiring pattern by chemical metal plating using a negative pattern made of a photosensitive resin composition layer as the plating resist, wherein the photosensitive resin comprises at least a linear high polymer composed of repeating units expressed by the following general formula (1) ;
    where, R 1 is any of H, an alkyl group having 1-9 carbon atoms, an alkoxy group having 1-9 carbon atoms, and a carboxyalkyl group having 1-9 carbon atoms, R 2 is an alkyl group having 0-9 carbon atoms, and n is the polymerized number of the repeating unit, and an organic compound expressed by the following general formula (2) ;
    where, R 3 is either of H or an alkyl group having 1-6 carbon atoms, X is either of NH or S, and Z is either of N or C-Y, where Y is any of H, NH 2 , or SH.

    摘要翻译： 一种印刷电路板的制造方法，其特征在于，使用由感光性树脂组合物层构成的负极图案，通过化学金属电镀形成配线图案作为电镀抗蚀剂，其特征在于，所述感光性树脂至少含有由以下所示的重复单元构成的直链状高分子 通式（1）; 其中，R1是H，具有1-9个碳原子的烷基，具有1-9个碳原子的烷氧基，和具有1-9个碳原子的羧烷基，R2是具有0- 9个碳原子，n为重复单元的聚合数，以及由以下通式（2）表示的有机化合物。 其中，R3为H或具有1-6个碳原子的烷基，X为NH或S，Z为N或C-Y，Y为H，NH2或SH中的任一个。

    Multilayer circuit board and photosensitive resin composition usable therefor
    4.
    发明公开
    Multilayer circuit board and photosensitive resin composition usable therefor 失效
    Mehrschichtige Leiterplatte und dazu verwendbare photoempfindliche Harzzusammensetzung

    公开(公告)号：EP0825809A2

    公开(公告)日：1998-02-25

    申请号：EP97112509.1

    申请日：1997-07-22

    申请人： HITACHI CHEMICAL CO., LTD.

    发明人： Amou, Satoru ,  Suzuki, Masao ,  Suwa, Tokihito ,  Kawamoto, Mineo ,  Takahashi, Akio ,  Nemoto, Masanori ,  Fukai, Hiroyuki ,  Yokota, Mitsuo ,  Kobayashi, Shiro ,  Miyazaki, Masashi

    IPC分类号： H05K3/46 ,  G03F7/027

    CPC分类号： H05K3/0023 ,  G03F7/038 ,  H05K1/0373 ,  H05K3/4644 ,  H05K2201/0195 ,  H05K2201/0209 ,  Y10S428/901 ,  Y10T428/24322 ,  Y10T428/24917 ,  Y10T428/31511 ,  Y10T428/31529

    摘要： A multilayer circuit board with blind via-holes (5) having a resolution in the range of 25 ∼ 80 µm and an aspect ratio in the range of 2.0 ∼ 0.6 for contacting the layers to each other thereby, wherein an insulating layer (1, 2) between said layers having the blind via-holes (5) has a glass transition temperature in the range of 150 ∼ 220 °C, and an epoxy group photosensitive resin composition being used therefor.
    A photosensitive resin composition having preferable resolution and heat resistance was found. A multilayer circuit board, of which thermal stress generated in the steps of a reflow process, a gold wire bonding process, and a repairing process in a bare chip mounting process, and peeling off the conductor wiring and deformation of the multilayer circuit board caused by mechanical stresses at the heating processes were suppressed, was obtained.
    Accordingly, decreasing size and weight of electronic apparatus became possible.

    摘要翻译： 一种多层电路板，其具有分辨率在25〜80μm范围内的盲孔（5）和宽度比在2.0〜0.6范围内，用于使层彼此接触，其中绝缘层（1 ，2）具有盲通孔（5）的所述层之间的玻璃化转变温度在150〜220℃的范围内，并且使用环氧基感光性树脂组合物。 发现具有优选的分辨率和耐热性的感光性树脂组合物。 一种多层电路板，其中在回流工艺步骤中产生的热应力，金线接合工艺和裸芯片安装工艺中的修复工艺，以及剥离导体布线和由多层电路板引起的变形 获得了加热过程中的机械应力。 因此，电子设备的尺寸和重量减小成为可能。