A tool for soldering pin-in-hole electronic circuit components includes a tool plate (10) with a set of holes (15) corresponding to the vias of a circuit board on which a circuit component is to be soldered. The board is aligned with the tool plate and hot gas is supplied through the set of holes to reflow solder in the vias. The tool is particularly suitable for use in removing a replacing circuit components. Use of particular gases allows soldering to be carried out without use of flux. Advantages of the tool are that it prevents burning the circuit board and/or unintentionally reflowing other circuit components mounted on the board.