公开(公告)号：EP4379256A3

公开(公告)日：2024-10-30

申请号：EP24167975.2

申请日：2017-06-22

申请人： Laserssel Co., Ltd

发明人： CHOI, Jae Joon ,  KIM, Byung Rock

IPC分类号： H01L21/52 ,  H01L21/268 ,  H01L23/00 ,  H01L21/677 ,  H01L21/60 ,  H01L23/13 ,  H01L25/065 ,  H01L33/48 ,  B60Q1/26 ,  H05K13/00 ,  B23K37/047 ,  H01L21/673 ,  H01L21/68 ,  H05K13/04 ,  H05K13/08 ,  H01L21/67 ,  F21S41/151 ,  F21S41/19 ,  F21S43/14 ,  F21S43/15 ,  F21S43/19

摘要： Disclosed are a laser bonding apparatus and a laser bonding method capable of bonding an electronic component to a three-dimensional structure having a regular or irregular shape in a curved portion such as an automobile tail lamp or a headlamp. The laser bonding apparatus and method for a three-dimensional structure may prevent misalignment and poor bonding of the electronic component with respect to the three-dimensional structure.

公开(公告)号：EP3490361B1

公开(公告)日：2024-10-09

申请号：EP16909500.7

申请日：2016-07-20

IPC分类号： H05K13/04 ,  H05K13/08

CPC分类号： H05K13/04 ,  H05K13/0473 ,  H05K13/087 ,  H05K13/0815

公开(公告)号：EP4424127A1

公开(公告)日：2024-09-04

申请号：EP22709014.9

申请日：2022-01-21

申请人： Bosch Car Multimedia Portugal, S.A. ,  Universidade do Minho

发明人： OLIVEIRA FARIA, Rui Alexandre ,  DA SILVA QUINTELA, José Humberto ,  PINTO ANTUNES PINHÃO, Mário José ,  MARTINS MIRANDA, Ana Catarina ,  DO CÉU GRAMAXO OLIVEIRA SAMPAIO, Álvaro Miguel ,  VILELA PONTES, António José ,  SILVA DA COSTA VEIGA, João Guilherme ,  CASTRO SILVA, Luís Carlos ,  MACHADO RODRIGUES LIMA, Susana ,  MENDES MACHADO, José ,  BIZARRO DE MEIRELES, José Filipe ,  MESQUITA CUNHA MACHADO MALHEIRO, Maria Teresa ,  ANDRADE PEREIRA GONÇALVES, Arminda Manuela ,  FERNANDES SOARES, Roberto Carlos ,  GONÇALVES PIMENTA, Tiago Filipe

IPC分类号： H05K13/04

CPC分类号： H05K13/0409

公开(公告)号：EP3979778B1

公开(公告)日：2024-08-07

申请号：EP19930997.2

申请日：2019-05-31

IPC分类号： H05K13/04 ,  H05K13/08

CPC分类号： H05K13/0409 ,  H05K13/086

公开(公告)号：EP3609307B1

公开(公告)日：2024-07-24

申请号：EP17904456.5

申请日：2017-04-05

IPC分类号： H05K13/02 ,  H05K13/04

CPC分类号： H05K13/02 ,  H05K13/0419

公开(公告)号：EP3713385B1

公开(公告)日：2024-07-03

申请号：EP17932091.6

申请日：2017-11-14

IPC分类号： H05K13/04 ,  H05K13/06 ,  H05K13/08

CPC分类号： H05K13/06 ,  H05K13/0408 ,  H05K13/0882

公开(公告)号：EP3550951B1

公开(公告)日：2024-07-03

申请号：EP16923060.4

申请日：2016-12-02

IPC分类号： H05K13/04

CPC分类号： H05K13/041 ,  H05K13/0413

公开(公告)号：EP4336983A3

公开(公告)日：2024-05-15

申请号：EP24153944.4

申请日：2019-12-19

申请人： Jabil, Inc.

发明人： Mark, Tudman ,  Loftin, Rayce

IPC分类号： H05K13/00 ,  H05K13/04

CPC分类号： H05K13/0069 ,  H05K13/0469

摘要： The present invention discloses a carrier (316, 802, 1166) configured to support a printed circuit board (104, 310, 806, 1162) during at least an underfill process, comprising: an outer frame comprising an open aspect, at least one heater (804, 1002), and an air circulator (1004) for distributing heat from the at least one heater (804, 1002) onto a bottom of the printed circuit board (104, 310, 806, 1162); and at least one frame inset (810) configured to be removably placed within the open aspect, and configured to support the printed circuit board (104, 310, 806, 1162).

公开(公告)号：EP3506728B1

公开(公告)日：2024-05-15

申请号：EP16914181.9

申请日：2016-08-24

IPC分类号： H05K13/08 ,  H05K13/04 ,  G03B7/00

CPC分类号： H05K13/0408 ,  H05K13/0812 ,  H05K13/0882 ,  G03B7/003

公开(公告)号：EP3917302B1

公开(公告)日：2024-05-01

申请号：EP19911230.1

申请日：2019-01-25

IPC分类号： H05K13/08 ,  H05K13/04

CPC分类号： H05K13/0419 ,  H05K13/087