The invention relates to a process for producing micro-structure components on a substrate bearing electronic circuits co-operating functionally with the micro-structure components. The latter may be made of both synthetic material and metal. According to the invention, a first layer of a synthetic material is applied to the substrate, with which it forms a solid bond. On this layer is applied a second layer of a synthetic material with which an internal separating medium has previously been mixed. The second layer is then embossed with a micro-structured tool. If metal micro-structure components are required, the embossed layer is subsequently galvanically shaped.