公开(公告)号：EP0683902B1

公开(公告)日：1998-08-26

申请号：EP94905683.2

申请日：1994-01-22

申请人： Forschungszentrum Karlsruhe GmbH

发明人： MICHEL, Andreas ,  HARMENING, Michael ,  BACHER, Walter ,  BLEY, Peter ,  RUPRECHT, Robert ,  BOTH, Alexander

IPC分类号： G03F7/00

CPC分类号： G03F7/00 ,  B81C1/00246 ,  B81C2203/0735

摘要： The invention relates to a process for producing micro-structure components on a substrate bearing electronic circuits co-operating functionally with the micro-structure components. The latter may be made of both synthetic material and metal. According to the invention, a first layer of a synthetic material is applied to the substrate, with which it forms a solid bond. On this layer is applied a second layer of a synthetic material with which an internal separating medium has previously been mixed. The second layer is then embossed with a micro-structured tool. If metal micro-structure components are required, the embossed layer is subsequently galvanically shaped.

公开(公告)号：EP0646188B1

公开(公告)日：1996-04-17

申请号：EP93911747.9

申请日：1993-05-17

申请人： Forschungszentrum Karlsruhe GmbH

发明人： BACHER, Walter ,  BLEY, Peter ,  HARMENING, Michael

IPC分类号： C25D1/10

CPC分类号： C25D1/10 ,  B29C59/022 ,  B29C59/026 ,  B29C2059/023 ,  B81C99/009

摘要： A tool for embossing galvanically mouldable plastic layers has a base plate and a plurality of raised microstructures arranged on the base plate with front faces parallel to the base plate. The tool is characterized in that the front faces have a surface roughness with a peak-to-valley height Rt in a range between 0.1 νm and 10 νm at an average roughness value Ra from 0.01 νm to 1 νm.

公开(公告)号：EP0500620B1

公开(公告)日：1996-11-27

申请号：EP90916248.9

申请日：1990-11-07

申请人： Forschungszentrum Karlsruhe GmbH

发明人： BLEY, Peter ,  HEIN, Herbert ,  MOHR, Jürgen ,  SCHOMBURG, Werner

IPC分类号： G03F7/36

CPC分类号： B82Y15/00 ,  C25D1/003 ,  G03F7/00

摘要： In the process, negative moulds of the microstructures are produced from plastics material on an electrically conducting substrate by electron-beam lithography, X-ray lithography or microforming techniques, and the cavities in the negative moulds filled with metal by electrodeposition, using the electrically conducting substrate as an electrode. The invention proposes that, during the production of the negative moulds, a residual layer of plastics material be left on the electrically conducting substrate at the bottom of the mould cavities and, before filling the mould cavities with metal by electrodeposition, this plastics layer on the floor of the cavities is removed by reactive ion etching using ions accelerated perpendicularly towards the surface of the substrate.