发明公开
EP0686669A2 Compositions for protecting semiconductor elements and semiconductor devices
失效
Zusammensetzungen zum Schutz von Halbleiterelementen und Halbleitervorrichtungen
- 专利标题： Compositions for protecting semiconductor elements and semiconductor devices
- 专利标题（中）： Zusammensetzungen zum Schutz von Halbleiterelementen und Halbleitervorrichtungen
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申请号： EP95108670.1申请日： 1995-06-06
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公开(公告)号： EP0686669A2公开(公告)日： 1995-12-13
- 发明人: Mine,Katsutoshi, Dow Corning Toray Silicone Co Ltd , Naito,Hiroyoshi, Dow Corning Toray Silicone Co Ltd , Yamakawa, Kimio, Dow Corning Toray Silicone Co Ltd
- 申请人： Dow Corning Toray Silicone Company, Limited
- 申请人地址： Mitsui Bldg. No. 6, 2-3-16, Nihonbashi-Muromachi, Chuo-Ku Tokyo 103 JP
- 专利权人： Dow Corning Toray Silicone Company, Limited
- 当前专利权人： Dow Corning Toray Silicone Company, Limited
- 当前专利权人地址： Mitsui Bldg. No. 6, 2-3-16, Nihonbashi-Muromachi, Chuo-Ku Tokyo 103 JP
- 代理机构： Spott, Gottfried, Dr.
- 优先权： JP147072/94 19940606
- 主分类号： C08L83/04
- IPC分类号： C08L83/04 ; C08L101/04
摘要：
Curable silicone compositions comprise either (a) microparticles of a fluororesin, which exhibits low adhesion to the cured composition, or (b) microparticles of an organic or inorganic material whose surfaces have been coated with this type of fluororesin. The compositions are useful coatings for semiconductor devices requiring high levels of moisture- and heat-resistance.
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