发明公开
- 专利标题: A process for covering particle board
- 专利标题(中): 涂覆颗粒板的方法
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申请号: EP95500106.0申请日: 1995-07-20
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公开(公告)号: EP0715935A3公开(公告)日: 1997-02-26
- 发明人: Eek-Vancells, Luis
- 申请人: PATENTES Y NOVEDADES S.L.
- 申请人地址: Passeig de Sant Joan 15 E-08010 Barcelona ES
- 专利权人: PATENTES Y NOVEDADES S.L.
- 当前专利权人: PATENTES Y NOVEDADES S.L.
- 当前专利权人地址: Passeig de Sant Joan 15 E-08010 Barcelona ES
- 代理机构: Curell Sunol, Jorge
- 优先权: ES9402522 19941212
- 主分类号: B27N7/00
- IPC分类号: B27N7/00
摘要:
The process comprises impregnation of first sheets of paper with a first aqueous resin having a solids content of 30-60 % of urea-melamine-formaldehyde resin; from 4-10 % of a plasticizer; a surfactant wetting agent; a catalyst, and a mould stripping agent; impregnation of second sheets of paper with a second aqueous resin having a solids content of from 30-60 % of urea-melamine-formaldehyde resin; 0-8 % of a plasticizer; a surfactant wetting agent; a catalyst and a mould stripping agent, this impregnation until the sheets have a resin solids content of 30-60 % and a volatiles content of 5-7 %; forming an ensemble with a first sheet of paper, a second sheet of paper, a board, a second sheet of paper and a first sheet of paper; and pressing the ensemble, the press surface being at a temperature ranging from 130 to 180 °C
公开/授权文献
- EP0715935B1 A process for covering particle board 公开/授权日:1999-10-13
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