发明公开
EP0766301A3 Method of forming self-aligned contact holes using a sacrificial polysilicon layer
失效
一种用于生产使用多晶硅的辅助层自对准接触孔的方法
- 专利标题: Method of forming self-aligned contact holes using a sacrificial polysilicon layer
- 专利标题(中): 一种用于生产使用多晶硅的辅助层自对准接触孔的方法
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申请号: EP96113456.6申请日: 1996-08-21
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公开(公告)号: EP0766301A3公开(公告)日: 1998-04-15
- 发明人: Poschenrieder, Bernhard , Grewal, Virinder
- 申请人: SIEMENS AKTIENGESELLSCHAFT
- 申请人地址: Wittelsbacherplatz 2 80333 München DE
- 专利权人: SIEMENS AKTIENGESELLSCHAFT
- 当前专利权人: SIEMENS AKTIENGESELLSCHAFT
- 当前专利权人地址: Wittelsbacherplatz 2 80333 München DE
- 优先权: US534776 19950927
- 主分类号: H01L21/768
- IPC分类号: H01L21/768
摘要:
A method of forming a self-aligned contact hole, in particular a bitline contact, includes steps of first depositing a sacrificial polysilicon layer (4) on a spacer dielectric film (3), and thereafter patterning the polysilicon. The polysilicon layer is a sacrificial fill-in for a bitline contact stud. The method further includes depositing a middle-of-line (MOL) oxide (6) on the polysilicon layer (4), and planarizing the MOL oxide by chemical-mechanical polishing (CMP). Thereafter, the polysilicon layer (4) is etched away and the spacer dielectric film (3) is etched to form a self-aligned bitline contact.
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